The Fraunhofer Institute for Reliability and Microintegration IZM develops and implements new concepts for the assembly of highly integrated electronic systems. The work of Fraunhofer IZM bridges the gap between the providers of microelectronic components and technical system manufacturers (e.g. automotive or medical technology).

In 2008 the Departments “Module Integration and Board Interconnection Technologies (MDI&BIT)” and “Chip Interconnection Technologies (CIT)” merged to combine the research and development activities in the field of substrate interconnection technologies in one department called System Integration and Interconnection Technologies (SIIT). Here nearly 100 employees develop processes and materials for interconnection technology

on board, module and package level as well as for integrating electrical, optical and power-electronic components and systems.

We assist companies with application-oriented pre-competitive research as well as the development of prototypes and small quantity production. In this context we offer application advice and technology transfer as well as the further qualification of personnel through practical training. We cooperate closely with the Technical University of Berlin (Center for Microperipheric Technologies), especially within the scope of European joint projects and in the area of basic materials research for the packaging of integrated circuits.

Our main focus is the interconnection and encapsulation technology in the area of electronic packaging, such as:

• New solders, adhesives, wires and bumps
• Bumping technologies (electroless Ni/(Pd)/Au, immersion solder, stencil printing, mechanical stud or ball bumping)
• SMD, CSP and BGA assembly
• Flip Chip technologies (soldering, adhesive joining, thermocompression and thermosonic welding)
• Die attachment (soldering and adhesive joining)
• Wire and ribbon bonding (US, TS, Heavy wire and ribbon)
• Flip Chip underfilling and COB glob topping
• Transfer molding of flip chip, COB and component on lead frame devices
• Potting and conformal coating, hotmelt encapsulation
• Chip embedding
• Optical fiber and planar waveguide coupling, Fiber lenses and laser welding
• Thin glass and silicon photonics packaging

Furthermore we develop, functionalize and process innovative materials, such as:

• Bio polymers
• Nanoscale structured surfaces
• Additive metallizations
• Integration of optical waveguides

We particularly make every effort to meet the challenges of optical and power electronics, as well as the requirements of high-temperature and high-frequency applications.