Manufacturing & Prototyping
Fraunhofer Institute for Reliability and Microintegration
Department High Density Interconnect & Wafer Level Packaging & All Silicon System Integration Dresden ASSID
RF Integration
RF communication and remote sensing (radar/radiometric) systems are facing the demands of increasing complexity/number of frequency bands, increased bandwidths and higher frequencies for higher data throughput, while at the same time the power consumption, the form factor of the systems, and the overall system costs need to be reduced. Smart micro-/mm-wave systems will have to achieve self-reconfigurable operations for real-time efficient self-optimization of their performance. For such adaptive systems, high-performance tuning components and strategies for building monolithically integrated miniaturised reconfigurable RF circuits/front-ends are highly needed. Fraunhofer IZM is offering packaging concepts for such devices. The work is in strong cooperation with other groups at Fraunhofer IZM like the group RF & High-Speed System Design of Dr. Ivan Ndip.




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