Minimising the thermal resistance of packages by the design and optimisation of cooling concepts, taking into account high power losses, heat flux,and ambient temperatures.
Environmentally compatible product design requires an interdisciplinary approachcovering the entire lifecycle of the product. We offer support with strategic decision-making in the development of electronicproducts.
To identify weak points in the early stages of development, or to obtain the optimum geometry under consideration of external loads, finite element simulation (FE) are applied.
Fraunhofer Institute for Reliability and Microintegration IZM