Feature Topics

Fraunhofer Institute for Reliability and Microintegration

  • System in Package

    System-in-Package

    For the realization of electronic systems three different technological approaches are available; integration on a chip (More More) or in a component (More than Moore) as well as the integration in a package (system-in-package or heterogeneous integration).

  • RF - Technologies

    RF communication and remote sensing (radar/radiometric) systems are facing the demands of increasing complexity/number of frequency bands, increased bandwidths and higher frequencies. Fraunhofer IZM has a strong expertise on packaging such devices keeping cost and performance in a synergetic balance.

  • Sustainability

    Modeling and monitoring in power modules reduces cost. Expected lifetime can be predicted more accurately and the appropriate maintenance measures can be taken. Thus, modules no longer have to be oversized and high costs caused by production losses or even damage to machinery due to un-expected failure can be prevented.

  • Reliability

    The research area “reliability” is particularly significant at Fraunhofer IZM, as different materials with diverse thermal, mechanical and thermomechanical properties are used in the packaging process.

  • Smart Grid

    In just a few years, electricity distribution as we know it will transform radically. This quantum leap in power management requires innovative solutions in power engineering, measurement and control electronics and IT.

  • Cyber Physical Systems

    Cyber physical systems might sound like it belongs in a science fiction novel, but in fact it has the potential to change our economy to the same extent as PCs did. Abbreviated to CPS, cyber physical systems is our future - a future in the physical world of machines, equipment and devices is networked with the virtual world of the internet or cyberspace.