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Homepage > The Institute > Services > Process and Product Development

Services

Fraunhofer Institute for Reliability and Microintegration

Process and Product Development

Wafer Level System Integration

    • Polymers for High Density Wiring
    • Redistribution Technology
    • Die Stacking by Thin Chip Integration
    • Glass Substrates and Layers
    • RF Integration

System Integration & Interconnection Technologies

  • Photonics

    • LED Failure Analysis
    • LED Reliability
    • GlassPack
    • PrOpSys – Production Technology for Optical Systems

  • Systemintegration on Flex

    • Flip Chip Adhesive Bond Technologies
    • Flip Chip Soldering on Flexible Substrates
    • Ultrafine Pitch Soldering on Flexible Substrates
    • Ultrathin Solder Interconnections
    • Ultrathin Flip Chip Assemblies

  • Multifunctional Board

    • Au/Sn Reflow Soldering
    • Die Bond Soldering
    • Gold Stud Bumping
    • Single Chip Bumping
    • Chip on Board
    • Diebond, Pick and Place
    • Die and Wire Bonding for High Frequency Applications
    • Wire Bonding
    • Thermocompression Bonding

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Source: Fraunhofer-Gesellschaft: Fraunhofer Institute for Reliability and Microintegration - Services
Online in the Web ; URLhttp://www.izm.fraunhofer.de/en/institute/services/process_and_productdevelopment.html
[Date: 21.05.2012, 14:05 hour]]