Services

Fraunhofer Institute for Reliability and Microintegration

Testing, Qualification, Reliability

  • Qualification and Test Center (QPZ)

    New packages and solder alloys have to be tested in combination with different substrates with respect to their reliability behavior under defined thermal, climatic and/or mechanical stress conditions in the field.

  • Center for Interconnection Technologies

    Since 1994 the Center for Interconnection Technologies in Oberpfaffenhofen has acted as Fraunhofer IZM’s training, service and development center, especially in the areas of soldering, hand soldering, assembly and interconnection as well as crimping (German)