Services

Fraunhofer Institute for Reliability and Microintegration

Training

  • Courses for Chip and Wire Bonding

    DIe- und Drahtbondlehrgänge

    Chip and Wire bonding represents the largest part of all interconnection technologies used in semiconductor assembly and is constantly being used, optimized and further developed at Fraunhofer IZM.

  • Education in the Field of Assembly Technology

    Education in the field of assembly technology

    Two technologies have emerged to push miniaturization into the next millenium, both using bare die to attach them directly to the circuit card: Chip-and-Wire Technology and Area Array Packaging/Assembly (FC, CSP, BGA). The Fraunhofer IZM has taken up the challenge to provide deep insight into the processes to manufacturing personnel, production engineers and managers of production facilities in order to keep them ready for the future of production.