• Fraunhofer IZM / 01/01/2017 - 04/30/2017, t.b.d.

    EMC in Power Electronics – Electro Magnetic Compatibility

    Tutorial EMC in Power Electronics – Electro Magnetic Compatibility
    © Photo Fraunhofer IZM/ Volker Mai

    Advances in semiconductor technology drive power electronics to higher efficiencies and compact system designs. This progress comes along with an increasing effort to comply with EMC requirements. With dense placement, electromagnetic coupling between components raises influence on system behavior. Integration as a response to the market demands intensifies the challenges. The design becomes more complex and leads to significantly higher development costs.

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  • Nürnberg / 05/16/2017 - 05/18/2017

    SMT Hybrid Packaging in Nürnberg

    From April 26 - 28, 2016 the SMT Hybrid Packaging – Europe’s leading trade fair for System Integration in Micro Electronics – takes place in Nürnberg. Current products, services and innovations in the field of electronic manufacturing from a wide and international range will be presented to the public.

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  • Nürnberg / 05/16/2017 - 05/18/2017

    Experience Fraunhofer IZM at PCIM Europe 2017

    Messegeschehen | Fraunhofer IZM präsentiert neue Entwicklungen auf der PCIM Europe 2017

    In 2017, Fraunhofer IZM will be present at PCIM (= Power Conversion Intelligent Motion) Europe again. One of the world’s leading trade fair and conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management takes place at fairground Nürnberg in May.

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  • Cosmopolitan Hotel in Las Vegas, Nevada / 05/30/2017 - 06/02/2017

    ECTC 2017

    Electronic Components and Technology Conference (ECTC) / Logo

    Das Fraunhofer IZM wird in diesem Jahr wieder mit einem eigenen Stand auf der angegliederten Messe der ECTC vertreten sein und dabei sein gesamtes Dienstleistungsspektrum im Bereich des Electronic Packaging präsentieren.

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