/  October 22, 2014  -  October 24, 2014

9. IMPACT Conference

The 9th IMPACT Conference (International Microsystems, Packaging, Assembly, Circuits Technology) will take place from October 22 – 24, 2014 in Taipei, Taiwan.

This year, the event joins forces with the 16th EMAP (International Conference on Electronics Materials and Packaging).

The IMPACT Conference is the largest gathering of packaging and PCB professionals in Taiwan and provides a great opportunity for industry and academia to catch up on the latest developments in microsystems technology. Fraunhofer IZM's Andreas Ostmann will be giving an invited talk on the topic „Modular sensor kit with embedded components“.

For more information please click here: www.impact.org.tw/2014/General