Events

Medical applications, in particular, benefit from advanced assembly and packaging technologies, which maximize the functional density and reliability of mesa-, micro- and nanosystems. Such technologies have so far been successfully applied to products like pacemakers, hearing aids, bio-microfluidic devices like lab-on-chip platforms or retinal implants and find their way to medical use in apparel and everyday objects. By using telemedicine infrastructure combined with advanced sensor technology and non-obtrusive system integration for constant monitoring at the point-of-care (POC), overall medical costs are reduced while quality of care is improved.

Fraunhofer IZM acts as a one-stop-shop solution provider for customers from research and industry in search for miniaturized integration of microelectronic, microsensory, microfluidic and micro-optical systems.

At COMPAMED 2014 IZM-scientists will be presenting current research highlights from the realm of medical engineering together with other Fraunhofer institutes.

Come and see us in Hall 8a, booth K38!