Events

At PCIM you can experience the complete spectrum of services from Fraunhofer IZM in the realm of power electronics – focusing on system design, packaging technologies and reliability aspects of power electronic systems. Meet us in Hall 6, booth 234 and see, among other things, how Fraunhofer IZM researchers, together with colleagues from ETH Zurich, are planning to meet Google’s Little Box Challenge of designing the world’s smallest inverter.

PCIM (Power Conversion Intelligent Motion) is of the world’s leading trade fair and conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management takes place at fairground Nuremberg in May. Visitors can discover new products and services e.g., for client industries in the fields of mechanical engineering, e-mobility or automobile electronics here.

More Information here.

Special Session auf der PCIM 2015
 

Passive Components - Tuesday 19.05.2015, 11:00 - 13:00 hrs

11:30 Reducing Inductor Size in High Frequency Grid Feeding Inverters

M.Sc. Stefan Hoffmann, Fraunhofer IZM, Berlin, Deutschland

Increasing switching frequency of power electronic devices is the most efficient way to reduce their volume. Especially for grid feeding inverters, the size of the inductors can be reduced remarkably, if the right strategy is applied. This paper shows a possible solution using SiC-MOSFETs, applying triangular current mode (TCM) and zero voltage switching (ZVS). This leads to a tremendous reduction in the inductor nominal value, but results in 100% ripple requirement for this component.

Oral Session
 

SiC High Power - Tuesday 19.05.2015, 11:00 - 13:00 hrs

11:30 Embedded very fast switching Module for SiC Power MOSEFTs

Prof. Dr. Eckart Hoene, Fraunhofer IZM, Berlin, Deutschland

With SiC semiconductors, switching speed can be increased significantly, and passive components can be reduced in size and cost. The embedding technology reduces parasitics. This paper focusses on how such a module needs to be designed to meet the needs in thermal aspects, in how it has to be designed for optimizing the parasitics and manufacturing process.

Poster Sessions
 

Reliability - Tuesday 19.05.2015, 15:30 - 17:00 hrs

15:30 Active Power Cycling Results using Copper Tin TLPB Joints as new Die-attach Technology

Christian Ehrhardt, Fraunhofer Institute IZM, Berlin, Deutschland

A new highly reliable die-attach technology for high operating temperature is called Transient Liquid Phase Bonding (TLPB). The TLPB is based on phase transformation into intermetallic phases using a low melting solder layer and a high melting bonding surface. In active power cycling analysis between +30 °C and 180 °C (DeltaT = 150 K) the TLPB showed more than 100-times longer lifetime compared to eutectic SnAg-solder.

15:30 Laser Cuts Increase the Reliability of Heavy-Wire Bonds and Enables On-line Process Control with Thermography

Dr. Andreas Middendorf, Fraunhofer Institute IZM and Technische Universität Berlin, Berlin, Deutschland

Nominated for the Best Paper Award

Observations of break down heavy wire bonds show a significant decrease of cycles in strength with increasing wire diameter. The innovation about this is the shaping of a chute on the bonding surface with a laser. Previously the particular depth of cut is determined by simulation. In addition, the method can be used as "non-destructive" in-situ measurement. The notches work as a magnifier for the thermography camera and eliminate the preconditioning e.g. with black coloring.