Fraunhofer Institute for Reliability and Microintegration IZM/ July 02, 2014
Workshop: Power Embedding 2014
On July 2, 2014 Fraunhofer IZM will be holding a workshop on Power Embedding at the Fraunhofer-Forum in Berlin. The focus of the event is on new requirements for design and robustness of power electronics connected with the growing importance of packaging technology in the last years. Fraunhofer IZM faces this challenge with an exceptional but easy to produce and extremely reliable power embedding concept.
The workshop is aimed at R&D suppliers for original equipment manufacturers as well as electronic packaging specialists in the field of product development and quality assurance.
Online Registration here.
