Events

From May 5 - 7, 2015 the SMT Hybrid Packaging – Europe’s leading trade fair for System Integration in Micro Electronics – takes place at fairground Nuremberg. Current products, services and innovations in the field of electronic manufacturing from a wide and international range will be presented to the public. Main topics are design and development, PCB production, components, assembly, soldering, packaging and test systems.

We cordially invite you to visit Fraunhofer IZM in Hall 6! There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratory. Have a look at the newest applications in power electronics, sensor networks and sensor pakaging.

More Information here.