Nürnberg / May 16, 2017 - May 18, 2017
SMT Hybrid Packaging in Nürnberg
https://www.mesago.de/de/SMT/home.htm
hall 4, stand 4-258
https://www.mesago.de/de/SMT/home.htm
hall 4, stand 4-258
From May 16 - 18, 2017 the SMT Hybrid Packaging – Europe’s leading trade fair for System Integration in Micro Electronics – takes place in Nürnberg. Current products, services and innovations in the field of electronic manufacturing from a wide and international range will be presented to the public. Main topics are design and development, PCB production, components, assembly, soldering, packaging and test systems.
There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories. Have a look at the newest applications in power electronics, assembly and interconnection technologies.
At the SMT 2017, the Fraunhofer IZM will be showcasing its core competences in the wafer, assembly, system integration, and reliability developments.
The show includes: