Berlin’s academic expertise in reliable packaging is taking a new step forward with TU Berlin’s appointment of Martin Schneider-Ramelow as Honorary Professor of Electronic Materials / Electronic Packaging. The appointment recognizes Schneider-Ramelow’s international profile and expertise in wire bond quality and reliability. In his new role, Schneider-Ramelow, who has already been teaching at the TU Berlin for over 20 years and is Head of the Fraunhofer IZM Department of System Integration and Interconnection Technologies, will be bolstering both the region’s reputation in application-oriented research and training, and the longstanding cooperation between the TU Berlin and Fraunhofer IZM.

About Prof. Dr.‐Ing. Martin Schneider‐Ramelow

24.09.1964 born in Thuine (Emsland), Niedersachsen, Germany

1987-1991: Study of materials science [engin.] at TU Berlin and PhD there at the materials department in 1998.

1991–1998: Scientific assistant at TU Berlin first at the department of metallurgy and then at materials technology.

Since 1998 project and group leader (chip and wire technologies) and since 2008 head of department SIIT (System Integration and Interconnection Technologies) at Fraunhofer IZM Berlin as well of IZM´s Branch Lab Microsystem Engineering in Berlin Adlershof. He is an approved expert in the field of quality and reliability of wire bond interconnects.

Since 2001 he has a lectureship at the Technical University of Berlin (“Materials for System Integration”). Furthermore he is the actual president of IMAPS Germany and chairman of the DVS working group AG2.4 “Bonden”.

More Information about Prof. Martin Schneider-Ramelow you will find here.