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Homepage > Services > Manufacturing & Prototyping

Services

Fraunhofer Institute for Reliability and Microintegration

Manufacturing & Prototyping

Wafer Level System Integration

    • Polymers for High Density Wiring
    • Redistribution Technology
    • Die Stacking by Thin Chip Integration
    • Glass Substrates and Layers
    • RF Integration
    • Sensors and Sensor Packaging
    • Electroless Nickel Bumping
    • Fabrication of Nanoporous Gold Deposits
    • Micro Battery
    • 300 mm Wafer Bumping
    • 3D Wafer Level Sytem Integration – TSV Interposer
    • Temporary Wafer Bonding/ Debonding
    • Die Bonding / 3D Stacking
    • Wafer Thinning
    • Wafer Singulation
    • Wafer Level Packaging & Test
    • Chemical-Mechanical Planarization (CMP)
    • Metrology Assembly Area

System Integration & Interconnection Technologies

    • Laserfusion
    • Au/Sn Reflow Soldering
    • Die Bond Soldering
    • Gold Stud Bumping
    • Single Chip Bumping
    • Chip on Board
    • Diebond, Pick and Place
    • Die and Wire Bonding for High Frequency Applications
    • Production of Large-core couplers
    • Fiber lensing
    • Hot embossing
    • Waveguides and lenses made by ion exchange in thin glass foils
    • Splicing
    • Large diameter cleaver
    • CO2 laser drilling of glass (TGV)

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Source: Fraunhofer-Gesellschaft: Fraunhofer Institute for Reliability and Microintegration - Services
Online in the Web ; URLhttp://www.izm.fraunhofer.de/en/services/manufacturing_prototyping.html
[Date: 19.06.2013, 10:34 hour]]