IMAPS - Fraunhofer IZM

Konferenz / 11. Oktober 2021

What does 6G mean for packaging?

Das Fraunhofer IZM auf der IMAPS 2021

Das 54. International Symposium on Microelectronics wird von der International Microelectronics Assembly and Packaging Society (IMAPS) organisiert. An drei Tagen bietet das Symposium 5 technische Tracks sowie eine interaktive Poster-Session, die sich auf Packaging-Technologien für die Märkte 5G, Hochleistungsrechner, Automotive, Industrie, Verteidigung/Raumfahrt und medizinische Elektronik konzentrieren.

Am 11. Oktober referieren sechs IZM-Kolleg*innen von 12:00pm – 2:15pm PST in einem online-Workshop zum Thema „What does 6G Mean for Packaging?“ Der Workshop wird aufgezeichnet und steht allen angemeldeten Teilnehmer*innen der Konferenz im Nachgang zur Verfügung.

Veranstaltungsdetails

Anmeldung

Anmeldung: https://imaps.org/symposium_registration.php

Veranstaltungsort

Online

Datum

11. Oktober 2021

Diesen Termin als iCal herunterladen

All times are Pacific Standard Times (PST)

12.00 Keynote: The leap from 5 to 6G

Prof. Dr.-Ing. Ivan Ndip Abteilungsleiter RF & Smart Sensor Systems am Fraunhofer IZM Berlin — © MIKA-fotografie | Berlin
Ivan Ndip

Use cases, packaging requirements and challenges. Novel antenna-in-package (AiP) solutions for 5G mmWave and 6G. Discussion of most significant differences between 5G and 6G.

12.30 Cost-optimized manufacturing technologies for RF packages

Tanja Braun / MIKA-fotografie | Berlin — © MIKA-fotografie | Berlin
Tanja Braun

Use cases, packaging requirements and challenges. Novel antenna-in-package (AiP) solutions for 5G mmWave and 6G. Discussion of most significant differences between 5G and 6G.

12.50 Glass interposer technology for highly compact high-frequency applications

Low loss packaging concepts based on glass substrates and through glass vias. Presentation of wafer level processes and technologies for glass interposer

01.10 Photonic packaging

Hermann Oppermann Gruppenleiter Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM Gustav-Meyer-Allee 25 — © MIKA-fotografie | Berlin
Hermann Oppermann

Dense optical and electrical interconnects, RF transmission and thermal management. Fine pitch bumping, high precision bonding, low temperature joining and cost effective assembly methods for reliable products

01.30 Photonic systems for massive communication

Dr. Tolga Tekin - Fraunhofer IZM — © Fraunhofer IZM/ Erik Müller
Tolga Tekin

Optical interconnects for low latency, low power, high bandwidth, high density. Photonic system integration for massive communication applications, such as datacenters, 5G, and next generation computing.

01.50 Aging of RF materials

Dr.-Ing. Hans Walter Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM — © MIKA-fotografie | Berlin
Hans Walter

Influence of different accelerated aging conditions and various durations on the properties of RF laminates

Messen, Konferenzen, Veranstaltungen