Projects

Projects

Assembly & test paradigm for next gen. 800G and 1.6 T transceivers

MASSTART (2019-2021)

Projects

Production Lines for Chip Realization with MtM-Technologies

ADMONT (2015-2019)

Projects

Si-Photonik-Matrix for low power/low cost data centers

L3MATRIX (2015-2019)

Projects

Wireless Localization of Systems in Production and Assembly Lines

NaLoSysPro (2015-2018)

Projects

Optical data transmission on-board, board-to-board, rack-to-rack

PhoxTroT (2012-2017)

Projects

MtM Component Implementation into Modular Interposers

CarrICool (2014-2016)

Projects

μ-structured luminous Diodes for innovative adaptive Headlights

µAFS (2013-2016)

Projects

3D Process Technology for innovative 3D-SiP Solutions

Master_3D (2012-2016)

Projects

Wafer-level Fabrication of a MEMS Package

Go4Time (2010-2014)

Projects

Gold TSV Technology

PARADIGM (2010-2014)

 

Projects

Research Network "Functional Integration in Micro and Nanoelectronics"

Fraunhofer, TU Dresden and TU Chemnitz cluster their competencies in the fields of micro / nano electronics. Research know-how will – in close cooperation with resident companies – be extended and innovations can be implemented more  quickly into applications and products.