Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

Key Research Area

EMC Modeling and Design of Packages, Particularly Signal and Power Distribution Networks

Integration density keeps increasing to meet the ever rising demand for miniaturized electronic products. A number of strategies are used to make this possible, including mounting the components as compactly as possible, using interconnects with smaller widths and less pitch and applying advanced 3D integration techniques such as chip stacks. However, high-density integration when combined with operating frequencies over 1 GHz can cause electromagnetic reliability (EMR/EMC) problems such as reduced signal and power integrity, electromagnetic interference (EMI) and electromigration.

Our research group develops methods for analyzing, quantifying and minimizing EMR/EMC problems at chip, package and PCB levels. Examples of EMR/EMC problems include reflection, delay, attenuation, crosstalk, current crowding, simultaneous switching noise (SSN) and consequent cross-coupling.
This is especially true of signal and power distribution networks (SDNs and PDNs).  Traditionally, design and optimization of the chip, package and board are tackled separately. However, in the microwave range, the interaction between the SDNs and PDNs can impede system performance.

Our research develops techniques for modeling and optimizing SDNs and PDNs on chip, package and board level as entire systems at the very beginning of the design cycle. We analyze the interaction between the components of the two networks very carefully and develop measures for minimizing any EMR/EMC problems or interference.

Projects: EMC Modeling and Design of Packages

COGO

In this project, we are developing the packaging for two optical modulators on InP basis that will allow 100 Gb/s transmission rates. The technology includes thermocompression bonding at the chip-module interface and a ceramic ball-grid array at the module-board interface with optimized electrical bonds and was specially designed to cope with increased thermomechanical loading.

5 Layer Stack (CONTAG)

Here we are developing a layer stack with a defined and controlled electrical return path for signal vias, to suppress and minimize EMR/EMC problems, such as poor signal integrity (SI), power integrity (PI) and electromagnetic interference (EMI) in microsystems.

Autonomous sensor nodes for agriculture and the energy industry

Poor silage not only endangers livestock: it can harm other uses, like the production of green energy. The better the ensilage process, the more efficiently biogas can be produced. Progress in the area has long been stifled by the absence of suitable sensor technology to monitor the entire process from filling the silos to extracting the finished silage.

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