BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Fraunhofer-Gesellschaft//Fraunhofer Institute for Reliability and 
 Microintegration IZM//ENGLISH
BEGIN:VEVENT
UID:d83bd1d9-f41a-4e17-bfac-4ac8ccc6c219
DTSTAMP:20261015T130240Z
SUMMARY:Fan-out Wafer and Panel Level Packaging – A versatile Platform for 
 next Generation 2 and 2.5 D Packaging Solutions
DTSTART:20241022T140000Z
DTEND:20241022T144500Z
END:VEVENT
END:VCALENDAR