BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Fraunhofer-Gesellschaft//Fraunhofer Institute for Reliability and 
 Microintegration IZM//ENGLISH
BEGIN:VEVENT
UID:6a50c04c-432e-438c-a13f-8ee871bed1f5
DTSTAMP:20261015T130248Z
SUMMARY:Packaging using PCB embedding for compact\, robust sensor technolog
 y in maritime applications
DTSTART:20250304T150000Z
DTEND:20250304T154500Z
END:VEVENT
END:VCALENDAR