BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Fraunhofer-Gesellschaft//Fraunhofer Institute for Reliability and 
 Microintegration IZM//ENGLISH
BEGIN:VEVENT
UID:ddcb7128-2ea8-43c8-aeb4-c88319529416
DTSTAMP:20261015T114015Z
SUMMARY:Introduction to Multi-Project Fan-out Wafer- Panel Level Packaging
DTSTART:20211028T090000Z
DTEND:20211028T100000Z
END:VEVENT
END:VCALENDAR