The vertical arrangement of system components like logic- or memory chips as well as ASICs or sensors represents an efficient method for the volume reduction of systems but also for improvement of the systems electrical performance.
After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit. The event will be taking place in Dresden, Germany and will continue to explore a wider scope of 3D topics, including 3DIC Through-Silicon-Via (TSV) technology and the prerequisites for heterogeneous integration and high density systems for different applications.
Fraunhofer IZM will be presenting its latest research results both at the conference and at the concurrent exhibition, where the focus will be on 3D-integration, through silicon vias and panel level packaging. Come and see us at booth #1.