Events

Over the last 12 years the Electronics System Integration Technology Conference ESTC has established itself as one of Europe’s most important packaging events. After stops in Greenwich (2008), Berlin (2010) Amsterdam (2012), Helsinki (2014) und Grenoble (2016), ESTC is coming home this year to where it all started in 2006 - to Dresden. Here the European packaging community will meet up at the Westin Bellevue from September 18-21, 2018.

The concurrent exhibition will feature technological services and equipment from over 30 companies and research institutions from around the world. Fraunhofer IZM will be presenting its range of services in the areas of interconnection technologies, wafer level and sensor packaging, and reliability-

Come and see us in Dresden, we look forward to welcoming you at our booth!

For further information please go to: www.estc-conference.net