Fraunhofer Institute for Reliability and Microintegration IZMSummit / January 22, 2018 - January 24, 2018
Fraunhofer IZM ASSID at European 3D Summit
Dresden, 22.-24.01.2018
This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges in order to create Heterogeneous Integration and High Density Systems for different applications.
Fraunhofer IZM's ASSID Center ("All Silicon System Integration Dresden") will be presenting its latest research results both at the conference and at the concurrent exhibition.