Workshop  /  October 30, 2019  -  November 01, 2019

Modern Power Semiconductors and their Packaging

The main component of modern power electronics circuits is the semiconductor power switch. This course presents the fundamentals of power switches operations from a physical point of view, together with the specific peculiarities and the reason to use them in a special application. An overview on different packaging technologies and their properties, advantages and disadvantages, is also given. Requirements from the applications and possibilities to tackle them with a semiconductor package solution will be proposed.

The course is divided into two parts.

Part one tackles semiconductors and their theory:

  • Basics like pn junction fundamentals, bipolar and field
    effect transitors
  • comparison between semiconductor materials like
    silicon, SiC and GaN
  • fundamental mechanisms taking place durting swit-
    ching operation
  • driving technologies for power semiconductors

Part two introduces packaging theories:

  • Introduction, analyzing and discussing packaging
    technologies for modern power semiconductors
  • Interconnection solutions

The participants will be grouped and asked to team work on a real design. A final 1-day lecture is included where groups will compare and discuss the achievements and the design choices.