From May 16 - 18, 2017 the SMT Hybrid Packaging – Europe’s leading trade fair for System Integration in Micro Electronics – takes place in Nürnberg. Current products, services and innovations in the field of electronic manufacturing from a wide and international range will be presented to the public. Main topics are design and development, PCB production, components, assembly, soldering, packaging and test systems.

We cordially invite you to visit Fraunhofer IZM in Hall 4!

There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories. Have a look at the newest applications in power electronics, assembly and interconnection technologies.

At the SMT 2017, the Fraunhofer IZM will be showcasing its core competences in the wafer, assembly, system integration, and reliability developments.

The show includes:

  • A novel design concept that sinters flip-chip LEDs directly onto a circuit board. The silver sintering processes promises exceptional reliability in high-temperature environments.
  • The integration of electronics into 3D product surfaces, achieved by the three-dimensional remodelling of components produced quickly and flexibly with traditional production technology.
  • A 610 x 457 mm² panel processed with the new Fan-out Panel Level Packaging technology, one of the most revolutionary innovations in microelectronic packaging. The Fraunhofer IZM is the global leader pioneering the technology’s development and application.
  • The world’s first hybrid integrated on-board transceiver using a glass interposer.
  • A 3D X-ray detection module based on through-silicon via.