Workshop  /  02/12/2019

Polymer Ageing and Microelectronic Package Reliability

Contents

  • Introduction of polymers used in microelectronics
  • Important aspects of encapsulation technologies for reliable packaging
  • Aging mechanisms of polymers
  • Adhesion and interface degradation
  • Test methods and selection criteria for polymers in microelectronics packaging
  • Overview of state of the art measurement equipment
  • Moisture and temperature induced changes in material properties
  • Lifetime simulation by FEM taken polymer degradation into account
  • Failure mechanisms related to polymer ageing

Many electronic products used in different applications, such as automotive or medical but even consumer are exposed to extreme loading profiles as high temperatures, random vibrations or humid and or wet environments. Lifetime demands of 10 years and above in combination with these challenging environments requires well known materials and broad knowledge on their behaviour over the entire lifetime.

 

Polymers are widely used in microelectronics packaging e.g. as interconnect material, encapsulants or substrate. But polymers age with time, temperature and humidity. Aging means a change in properties including mechanical, thermo-mechanical or adhesion characteristics.
All, key factors for reliable package solutions. Hence, knowledge on materials and their aging behaviour is essential for developing reliable microelectronics packages and systems.