Last week the PLP consortium followed up last year's successful kick-off workshop, gathering together at Fraunhofer IZM's headquarters in Wedding to push ahead the group's agenda and work packages to advance fan out panel level packaging technology across industry. Four new consortium partners have now joined the already existing seventeen, proving that the consortium is steadily gaining traction in all the right research and industry areas. Preparations are already underway for the consortium's annual meeting in November, which will include a public workshop – interested parties should consider getting out their calendars now.