Fraunhofer Institute for Reliability and Microintegration IZMThe group Advanced Chip & Wire Bonding has fully automatic die and wire bonders available for all wire bonding methods. Apart from wedge/wedge bonding (Ø 17 – 75 μm) using stan- dard AlSi1 or specially coated Au wires at room temperature, our group has comprehensive know-how in ball/wedge bond- ing at room or elevated temperature using ultra-thin wires and alternative materials such as Cu. The possibilities for bonding of heavy wires (125–500μm) and ribbons up to 2 mm are used above all in power applications. All substrate types are bonded, including chips, PCBs, ceramics and leadframes.
Activities
- Process development and technology consulting
- Demonstrator and small series production + prototyping
- Damage case analyses and quality assessment
- Lifetime and aging tests
- Feasibility studies
- Training
Application areas:
- Power electronics
- RF applications
- Chip-on-board technologies
- Sensor applications
- Photonic applications, opto-electronics (laser, LED, ...)
- Multi-chip modules
- Flex substrates