Business Units

Fraunhofer Institute for Reliability and Microintegration

  • Power

    Power electronics are being employed in more and more areas and the applications are becoming increasingly complex and sophisticated. The possibilities created by the new semiconductor materials silicon carbide (SiC) and gallium nitride necessitate new directions in packaging technology.

  • Photonic

    Fraunhofer IZM’s research into photonics for communication and sensor systems, in which we combine optoelectronics and microoptics, has a three-fold aim: miniaturization, improving efficiency and increasing functionality.

  • 3D-Integration

    3D system integration is one of the most important topics in current packaging and interconnection. Based on the vertical stacking of system components the concept offers specific advantages with regard to the heterogeneous integration of different components, such as sensors, processors, memories or antennas.

  • Automotive/Transportation

    Since Fraunhofer IZM’s establishment, every department has included the application areas automotive and transportation technologies as core competences. The institute has worked with OEMs, tier 1s and, in particular, their suppliers to “electronify” the automobile at all levels.

  • Medical Engineering

    Medical technology will continue to have significant impact on the quality of life in our modern civilization. The adoption of electronics and microtechnology has had tremendous impact on previously uncurable diseases, on the autonomy of patients and promises improvements for future treatment and diagnosis.

  • Safety & Security

    Research for civil security: Our scientists are developing the security solutions of tomorrow. The department’s research areas include protective systems for emergency and rescue staff, crucial infrastructure, the security of manufacturing equipment, foodstuff quality assurance and tamper-proof identification of persons and products.