Electronic Packaging and System Integration

Fraunhofer Institute for Reliability and Microintegration

© Fraunhofer IZM / Volker Mai

Fraunhofer IZM’s labs send our warmest thanks for another year of outstanding mutual collaboration. We wish all of our customers and cooperation partners a sparkling Christmas and all the best for 2016.
 
Best regards,
Prof. Klaus-Dieter Lang

Packaging technology for electronic system integration

The Fraunhofer Institute for Reliability and Microintegration IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.

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