Packaging technology for electronic system integration

Fraunhofer IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.




The Fraunhofer IZM-ASSID joins DRESDEN-concept

The Fraunhofer IZM’s facilities in Dresden (All-Silicon System Integration - ASSID) and Bremen’s Fraunhofer IFAM have joined DRESDEN-concept as the newest members of the consortium. The total number of 24 partners from culture and science includes no fewer than seven Dresden-based Fraunhofer Institutes. 


News | Survey

What do you know about EcoDesign?

What do you want to learn? We, the Fraunhofer IZM and Circular Devices want to hear from you, so that we can adjust our Learning Factory EcoDesign more to your unique needs and expectations.  



The World’s Thinnest Speaker

The first miniature speakers using MEMS technology are being unveiled, sized between two and twelve millimetres, depending on the model. Their size makes the new speakers a perfect choice for mobile devices like smartphones, tablet computers, or headphones. 


News | Project

Photonic Applications for Spatial Light Modulators

The purpose of the "Photonic Applications for Spatial Light Modulators” (PALM) project is to develop LCOS (Liquid Crystal on Silicon) cells for the ultraviolet and short-wave infrared band.



Happy birthday, Herbert Reichl!

Very few researchers have had such a lasting impact on our understanding of microelectronics systems as Herbert Reichl. Prof. Reichl is celebrating his 72nd birthday today, January 12th, 2017. We congratulate him on his special day!



Panel Level Packaging Consortium Takes Up Its Work

Revolutionizing packaging technology: The Fraunhofer Institute for Reliability and Microintegration IZM is spearheading the transition from fan-out wafer to fan-out panel level packaging with an initiative that has brought together illustrious international partners. 


News / Award

Matthias Hutter wins Fraunhofer IZM Research Award

Hotting up high-temperature electronics. As expert in metallic bonding, Fraunhofer IZM’s Dr. Matthias Hutter has been exploring new types of bonds that ready electronics for high operating temperatures for over 20 years.



How fair is Fairphone 2?

Like its predecessor, the new smartphone Fairphone 2, released late 2015 by Dutch company Fairphone, lives up to its name. Fairphone listed fair workplace conditions, environmentally friendly fabrication and sustainability as its three main priorities in designing the technology and workflow. To find out how well Fairphone did, Telekom Deutschland recruited an evaluation by Fraunhofer IZM and Deutsche Umwelthilfe (DUH). 



More power for offshore wind energy

Bonding wire cracks can easily cause power modules in offshore wind farms to fail. One solution to this problem is aluminum-scandium alloy. Using thermal testing, we were able to improve the stability and resistance of the alloys.



Making Grids Intelligent – Astrose Sensors

The energy revolution in Germany does not stop at wind farms or solar panels. The power grids themselves need to change and adapt. The researchers at the Fraunhofer IZM have developed autonomous sensors that monitor the flow of power - power lines are learning to speak with each other.


Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.



Fraunhofer IZM's annual report is now available!



News & Events

Get a taste of Fraunhofer IZM labs...