Panel Level Packaging Consortium: Don´t miss it!

Fan-out Panel Level Packaging is THE manufacturing technology with the highest market potential. Learn more about it from June 28 - 29 at Fraunhofer IZM in Berlin!

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Fraunhofer IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.

News

 

Fraunhofer IZM Mourns the Death of Thomas Gessner

On 25 May 2016 the director of the Fraunhofer ENAS, Prof. Thomas Gessner, suddenly and unexpectedly died.

 

Event

2nd Summer School on Optical Interconnects

The second Summer School on Optical Interconnects will take place between 1st – 4th August 2016 in St.Andrews, Scotland, UK. It focuses on high-performance, low-energy and low-cost optical interconnects across the different hierarchy levels in data center and high-performance computing systems.

 

Event

4th Optical Interconnect in Data Centers Symposium

The symposium is part of the ECOC 2016 in Düsseldorf, which is the 42nd European Conference and Exhibition on Optical Communication, taking place on September 18 – 22. The symposium itself is focused on high-performance, low-energy and cost and small-size optical interconnects across the different hierarchy levels in data center.

 

Event

Panel Level Packaging Consortium - the place to be!

Fan-out Panel Level Packaging as well as Fraunhofer IZM's pre-competitive initiative on this subject will be discussed at our symposium from June 28-29.

We are happy to announce that Islam A. Salama of Intel and Walter Huck of Murata Europe have been confirmed as speakers.

 

 

Event

Electronics Goes Green 2016+

The conference is the most important event on microelectronics and the environment worldwide and will provide experts from science, industry and politics with a forum to discuss state-of-the-art technologies and current political trends with regard to microelectronics and its impact on the environment.

 

News

More Power for Offshore Wind Energy

Bonding wire cracks can easily cause power modules in offshore wind farms to fail. One solution to this problem is aluminum-scandium alloy. Using thermal testing, we were able to improve the stability and resistance of the alloys.

 

News

IZM’s Commitment to Girls’ Day Honored by Senator of Employment

The Girls’ Day has become a treasured tradition at the Fraunhofer IZM: Its thirteenth incarnation on April 28th again brought an interested group of schoolgirls into the Institute for a first-hand look at the world of microelectronics. 

 

Award

German Industry Innovation Award for Flexible Ultra-Thin Glass

Glass, thinner than a human hair, that bends and flexes? What sounds like science fiction has now become reality with the aid of the Fraunhofer IZM. Schott AG, one of the world’s leading producers of technical glass and long-standing research partner of the Fraunhofer IZM, has won the coveted German Industry Innovation Award.

 

Publications

Fraunhofer IZM's annual report is now available!

 

Prototyping-Line for Micro Batteries Opens in Berlin

Fraunhofer IZM has openend a dedicated 10-metre battery development and assembly line, capable of producing miniature, custom-designed micro batteries with unparalleled precision, on 15 March 2016.

 

News

Better Visibility when Driving at Night

According to statistics, the majority of accidents occur at dusk or at night – poor visibility is often the trigger. Intelligent headlights adapt to the current traffic situation, and can be a remedy. In collaboration with industry partners, Fraunhofer researchers have developed a high-resolution illumination system with more than 1,000 LED pixels.

 

News

Founding of the Centre of Excellence “Digital Networking”

On Tuesday 26 January 2016, the Berlin Senator for Economic Affairs, Technology and Research, Cornelia Yzer, and the Executive Director of the Fraunhofer Institute for Open Communication Systems, Prof. Dr. Manfred Hauswirth, signed the agreement for founding of the Digital Networking Centre of Excellence.

 

News

From Intelligent Knee Braces to Anti-theft Backpacks

Integrating electronic assemblies can level up the capabilities of textiles with many versatile functions, from monitoring to lighting and beyond. With 15 years of expertise in the field, the Fraunhofer IZM has created a universe of innovative applications for textiles. 

 

 

Overview

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