Electronic Packaging and System Integration

Fraunhofer Institute for Reliability and Microintegration

© Fraunhofer IZM

Packaging technology for electronic system integration

The Fraunhofer Institute for Reliability and Microintegration IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.

News

  • Research News: Perfectly designed microelectronics

    Microchips play an important role in industrial and household electronics. Their miniaturized circuits must not only function faultlessly but also consume as little energy as possible. Researchers are now working on making the tiny devices even more efficient.

  • Tracking down power grid reserves

    Increasing renewable energy penetration is leading to bottlenecks in distribution and transmission grids. However, with the right weather and an innovative sensor network with self-sufficient (autarkic) power supply, operators can tap reserve capacity by harnessing power line cooling.

  • Fraunhofer IZM at PCIM 2013

    Fraunhofer IZM will again be exhibiting at PCIM, the trade fair for Power Conversion and Intelligent Motion in Nürnberg. We will be presenting our entire spectrum of services in the realm of power electronics.

  • Fraunhofer IZM at the Measurement Fair SENSOR+TEST 2013

    The trade fair with the concurrent conferences is considered one of the leading events in sensorics, measuring and testing technologies in the world. A highlight from the area of sensor packaging is a new method for the hermetic sealing of MEMS components by 3D wafer level packaging.

  • Long Night of the Sciences 2013

    Where do the chips in a mobile phone, camera or pacemaker come from? Watch as scientists mount tiny components sized just a few thousandths of a millimeter on large silicon wafers and then saw these into individual microchips. We’ll be providing you with cleanroom garb to ensure not a single speck of dust impedes the chip reliability.

  • Celebrating 20 years of Fraunhofer IZM

    The world’s smallest camera, micropump, fuel cell, hearing aid and wireless sensor - Fraunhofer IZM has been big on tiny throughout the twenty years since its establishment. Why Fraunhofer IZM is not just celebrating an anniversary, but the starting point for new achievements. The world’s smallest camera, micropump, fuel cell, hearing aid and wireless sensor - Fraunhofer IZM has been big on tiny throughout the twenty years since its establishment. Why Fraunhofer IZM is not just celebrating an anniversary, but the starting point for new achievements.

  • Research Project "SeManTiK" Investigates Latest Chip-Integration Technologies for Contactless Identity Documents

    What are the requirements for electronic identity documents to provide reliable functionality during their long term of validity? Experts from German printing office “Bundesdruckerei”, the semiconductor manufacturer Infineon Technologies AG and the Fraunhofer Institute for Reliability and Microintegration IZM have teamed up in the research project "Secure and long-life eID applications for human-technology cooperation (SeManTik)" to find proper anwers.

  • Research Award for Faster and Reliable Data Transmission

    In today’s information age, in which everyone is online around the clock, unimaginable amounts of data crisscross the globe within seconds via sites like YouTube and Facebook. More and more data can be sent and received at ever faster speeds, while at the same time the reliability of the transmitted data is maintained and interference is prevented. How does technology make this possible? This question is the focus of the 2012 Fraunhofer IZM Research Award recipient, Dr. Ivan Ndip, an expert on high-frequency engineering and electromagnetic field theory.

  • Romper suit to protect against sudden infant death

    Breathing sensors built into romper suits could help prevent sudden cot deaths in the future. The basis for this is a stretchable printed circuit board that fits to the contours of the body and can be manufactured using routine industrial processes.