Packaging technology for electronic system integration

Fraunhofer IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.

News

 

Kick-off meeting Panel Level Packaging

December 8-9, 2016

In early December the founding members of the Panel Level Packaging Consortium will be meeting at Fraunhofer IZM in Berlin to discuss the next steps on their way to industry-wide adoption of PLP.

 

Event

Fraunhofer IZM presents current trends in photonic packaging at Photonics West 2017!

The Photonics West is the most influential conference for biophotonics and biomedical optics, high-power laser manufacturing, optoelectronics, microfabrication, and green photonics.

 

News / Award

John A. Wagnon Technical Achievement Award for Ivan Ndip

The 2016 John A. Wagnon Technical Achievement Award was awarded to Dr. Ivan Ndip for his outstanding technical contributions in the field of electromagnetic modeling, RF design and optimization of microelectronic components, modules and systems, especially for communication and radar sensor applications.

 

News / Award

Martin Schneider-Ramelow honored by IMAPS

For his years of dedication and support in various leadership roles Martin Schneider-Ramelow received the IMAPS Fellow of the Society Award from the International Microelectronics Assembly and Packaging Society (IMAPS).

 

News

How fair is Fairphone 2?

Like its predecessor, the new smartphone Fairphone 2, released late 2015 by Dutch company Fairphone, lives up to its name. Fairphone listed fair workplace conditions, environmentally friendly fabrication and sustainability as its three main priorities in designing the technology and workflow. To find out how well Fairphone did, Telekom Deutschland recruited an evaluation by Fraunhofer IZM and Deutsche Umwelthilfe (DUH). 

 

Event

A milestone in manufacturing technology

Fan-out panel level packaging (PLP) is an extremely cost-efficient manufacturing technology with huge commercial potential. Fraunhofer IZM recently brought together international stakeholders to begin shaping a long-term research strategy, with an expert symposium on June 28-29.

 

 

Event

Electronics Goes Green 2016+

The conference is the most important event on microelectronics and the environment worldwide and will provide experts from science, industry and politics with a forum to discuss state-of-the-art technologies and current political trends with regard to microelectronics and its impact on the environment.

 

News

More power for offshore wind energy

Bonding wire cracks can easily cause power modules in offshore wind farms to fail. One solution to this problem is aluminum-scandium alloy. Using thermal testing, we were able to improve the stability and resistance of the alloys.

 

News

Making Grids Intelligent – Astrose Sensors

The energy revolution in Germany does not stop at wind farms or solar panels. The power grids themselves need to change and adapt. The researchers at the Fraunhofer IZM have developed autonomous sensors that monitor the flow of power - power lines are learning to speak with each other.

 

Publications

IZM researchers co-edit book on optical interconnects

Together with their colleagues Nikos Plerus (Aristotle University of Thessaloniki) and Richard Pitwon (Seagate Systems) Fraunhofer scientists Andreas Hakansson and Tolga Tekin have co-edited a book on “Optical Interconnects for Data Centers” that will be released in November 2016. The book gives an overview of the state-of-the-art in this emerging field.

 

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

Publications

Fraunhofer IZM's annual report is now available!

 

Overview

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