Fraunhofer Institute for Reliability and Microintegration IZM/ May 28, 2013 - May 31, 2013
Electronic Components and Technology Conference (ECTC) 2013
The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology. The 63rd ECTC will be held at the Cosmopolitan of Las Vegas, Las Vegas, Nevada, USA from May 28 – 31, 2013.
Fraunhofer IZM will be exhibiting at the concurrent ESTC exhibition, presenting its range of services from the realm of electronic packaging to the American Packaging community.
Come and see us in Las Vegas, we look forward to welcoming you at our booth!
- Further information: http://www.ectc.net/