Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

Equipment Flex Assembly

Embedded thin film system in Strech-Flex
© Fraunhofer IZM

We offer a variety of assembly and interconnection techniques to our customers, including standard SMD processes as well as various flip-chip process solutions and solutions for applications such as Flex-to-Flex. Fine-pitch flip-chip processes are implemented in a cleanroom environment.

Equipment Flex Assembly:

  • SET FC150 Flip-Chip Bonder
  • SET FC150 FAV Flip-Chip-Bonder
  • Panasonic FCB3 Bonder
  • Finetech Sigma Bonder
  • Finetech Fineplacer mikro
  • Heißsiegel-Bügellötanlage COVATEC SR10-1130/3
  • Dispenser Musashi Shotmaster 300
  • Datacon evo Flip-Chip-Diebonder
  • LPKF ProtoPrint E
     

© Fraunhofer IZM

Working Group

System on Flex

The research group System on Flex at Fraunhofer IZM focuses on advancing the fields of flexible hybrid electronics, stretchable electronics and electronic textiles (smart textiles). The goal is developing innovative solutions for various applications. The group focuses on developing scalable manufacturing processes for flexible, stretchable and textile electronic systems.

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