Service

Heat spreaders are widely used in microelectronics to distribute heat loss as well as possible so that thermal resistance is minimized. A material is a heat spreader if it spreads the heat (distributes it over a larger area), so this task is usually performed by a material with good thermal conductivity, e.g. copper, aluminum, silicon or (artificial) diamond. However, the coefficient of thermal expansion (CTE) should always be considered, and it should be adapted as well as possible to the component (chip, semiconductor). A compromise is a heat spreader made of composite materials such as Cu/W with a matched CTE but less good thermal conductivity. Basically, however, a heatspreader is nothing more than a substrate under a semiconductor, e.g. laser, LED, transistor.

At Fraunhofer IZM, heat spreaders are used in the form of:

• Cu/W or Cu/Mo for optoelectronics (laser) and RF technology. IZM's expertise lies in the interconnection technology of semiconductor components to the heat spreaders
• Si in wafer level / 3D packaging. work of WLSI
• As Cu layers in panel level packaging (e.g. low-inductance packages)
• In power electronics
• LED packaging
• Lead-frame based packages
• Design of electronic packages