The department "Wafer Level System Integration" (WLSI) specializing in developing advanced packaging and system integration technologies thus being able to offer customer-specific solutions for microelectronic products in the overall scope of smart system integration.
Within the department approx. 60 scientists work at these topics at two locations: at Fraunhofer IZMs headquarter in Berlin and at the center “ASSID - All Silicon System Integration Dresden” (IZM-ASSID).
The department offers prototyping, small-volume production and a broad spectrum of R&D services to partners and customers. In numerous R&D projects, ongoing skills and know-how are continuously being developed which can be passed to SME-partners on a development stage. WLSI has also established a broad cooperation network with manufacturer and users of microelectronic products as well as with cleanroom equipment producers and material developers from the chemical industry from all over the world.