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Collaborating with Fraunhofer IZM

Laser Optics Berlin 2010
March 22-24, 2010, Berlin
For the fifth time running Fraunhofer IZM will be exhibiting at the Laser Optics Berlin. Under the heading of Photonic Packaging optical and optoelectrical packaging and interconnection technologies will be presented. Further Information

Fraunhofer IZM at the PCIM 2010
May 4-6, 2010, Nürnberg
For the fourth time Fraunhofer IZM will be exhibiting at PCIM, the trade fair for Power Conversion and Intelligent Motion in Nürnberg. The focus of the presentation will be on current IZM-research results and development trends from the realm of power electronics. Further Information

 Martin Schneider-Ramelow elected President of IMAPS Germany
Januar 2010
As of January 2010 Fraunhofer IZM’s Dr. Martin Schneider-Ramelow, head of the department System Integration and Interconnection Technologies, is the new president of the German IMAPS Chapter. Further Information

Microsystem technology facilitates self-determined living for the elderly
January 2010
Together with experts from different Berlin-based companies scientists at the Fraunhofer Application Center Smart System Integration have developed an electronic construction kit especially designed for the needs of elderly people. If required, the system can actively intervene … Further Information

 Fraunhofer IZM’s Rolf Aschenbrenner is new CPMT president
January 2010
IZM-scientist Rolf Aschenbrenner has been elected president of the IEEE CPMT Board of Governors. Further Information

3D Packaging Technology
March 2010
How can multi-sensor modules be even further miniaturized at considerably reduced manufacturing cost? The recently published report "3D Packaging Technology" gives a comprehensive overview of modular approaches of hetero integration that will be of utmost importance for manufacturing processes, especially in consumer electronics and in information and communication technology. Further Information


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