Fraunhofer Institute for Reliability and Microintegration IZM

Fraunhofer Institute for Reliability and Microintegration IZM

Versuchsaufbau mit Batteriezellen, Kabeln und Schläuchen in einem technischen Laborumfeld. / Experimental battery setup with cables and tubes in a technical laboratory environment.
© Fraunhofer IZM | Volker Mai

Innovative Zinc Battery Technology

Combining Long-Term Energy Storage and Hydrogen Production


REALIZM Blog | MAKING IDEAS HAPPEN

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© Fraunhofer IZM | Volker Mai

600kW-Wechselrichter
© Fraunhofer IZM | Volker Mai

600 kilowatts? This inverter knows how to keep its cool!

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© Fraunhofer IZM | Volker Mai

tsr-bnr Banner QWeld
© Fraunhofer IZM

Laser welding brought to quantum technology: Reliable fiber-PIC connections

more info

© Fraunhofer IZM

Erste Prototypen von SPAIA im Einsatz./ SPAIA - Society of People Against the Insect Apocalypse
© SPAIA

Measuring environmental damage with the help of insects

SPAIA - Society of People Against the Insect Apocalypse

more info

© SPAIA

banner - Chiplet Application Hub Gruppenfoto

FMD Launches the Chiplet Application Hub

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APECS Pilot Line with APECS Logo
© loewn | Bernhard Wolf

The APECS Pilot Line: Heterointegration enabling Chiplet Applications

REALIZM Blog
MAKING IDEAS HAPPEN

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© loewn | Bernhard Wolf

© R2M Solution | Nanogate Central and Eastern Europe GmbH

Innovative molding process for greener tech

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© R2M Solution | Nanogate Central and Eastern Europe GmbH

banner - Apecs logo, Hepp Grafik
© Fraunhofer IZM

Fraunhofer IZM is powering the evolution of chiplet technologies as part of the APECS pilot line

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© Fraunhofer IZM

Fraunhofer Mikroelektronik
© loewn

Launch of the Competence Center Green ICT @ FMD

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© loewn

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging vom Wafer zum System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration
System Integration & Interconnection Technologies
Environmental & Reliability Engineering
RF & Smart Sensor Systems

News

 

News | May 5, 2025

Fraunhofer IZM and TU Delft publish groundbreaking research findings

The joint research focused on improving the durability of silicon-based integrated circuits (ICs) in the corrosive environment of the human body.

mehr info
 

Workshop | July 2 - 3, 2025

Workshop on Component-to-System Level Packaging

Addressing Integration Challenges for Automotive and Industrial Applications

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© Fraunhofer IZM | Volker Mai

News | April 15, 2025

600 kilowatts? This inverter knows how to keep its cool!

Power inverters are the beating heart in the drive train of modern electric cars. They turn the electrical energy from the batteries into something that engines can actually use. Fraunhofer IZM has now redefined what this key component is possible of doing.

more info
 

© Fraunhofer IZM

News | April 8, 2025

Laser welding brought to quantum technology: Reliable fiber-PIC connections

Researchers at Fraunhofer IZM have developed a laser welding process that works without adhesives to connect Photonic Integrated Circuits (PICs) with optical fibers.

more info
 

© SPAIA

News | April 1, 2025

Measuring environmental damage with the help of insects

SPAIA - Society of People Against the Insect Apocalypse

In Germany, insect biomass has declined by over 75% in the last 27 years. With SPAIA, Collette Wasielewski and Tom Cox are working on an open-source system to collect insect data globally and protect biodiversity!

more info
 

© Fraunhofer-Gesellschaft

News | March 31, 2025

Major Advancement in Applied Research: FMD Launches the Chiplet Application Hub

On March 31, 2025, at the Hannover Messe, the Research Fab Microelectronics Germany officially unveiled its new Chiplet Application Hub. The Chiplet Center of Excellence is the first cluster of the hub.

more info
 

© R2M Solution

News | February 6, 2025

Innovative molding process for greener tech

The EU Horizon project MULTIMOLD has brought together researchers from Fraunhofer IZM and their international partners in the pursuit of a novel injection molding process that combines advanced electronic functionality with high environmental standards.

more info
 

News

Events

 

Conference | May 27 - 30, 2025

ECTC - 2025 IEEE 75th Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology.

more info
 

Workshop | July 02 - 03, 2025

Workshop on Component-to-System Level Packaging

The road to autonomous driving and the need for more electrified mobility have resulted in sizable changes for electronics such as semiconductors and batteries used in automotive applications. Smart homes and infrastructure, factory automation and preventive maintenance have driven significant advancements in industrial electronics too.

more info
 

© loewn

Change Hub Berlin | October 15 - 16, 2025

Green ICT Connect 2025

To promote an exchange between science, industry and politics on the topic of resource conservation in ICT, high-ranking representatives will meet for the third time at the conference for resource-conscious information and communication technologies »Green ICT Connect 2025«.

more info
 

Events

 

© Leistungszentrum Digitale Vernetzung

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

 

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

 

© Fraunhofer IZM | Volker Mai

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

 

© Kai Abresch photography

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

 

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

 

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

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