Welcome - Fraunhofer IZM

High-End Performance Packaging from Wafer to System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

News

Forum | September 30 – October 1, 2026

FIRST by FMD – Fast Innovation through Research in Semiconductor Technologies

New European conference on microelectronic trends, roadmaps and strategic alignment

Join the leaders shaping Europe’s semiconductor future at FIRST by FMD, taking place 30 September – 1 October 2026 in Berlin.

FIRST is a high-level trend forum for those who turn technology into industrial leadership.

more about first

News | April 28, 2026

Leveling up the electronics for e-mobility

European project develops next generation of on-board chargers

Electric cars should be better for the environment, powerful, but also affordable. However, the chargers built into them are hindering progress, as current models are reaching their limits in terms of efficiency, size, and reliability. The EU-funded HiPower 5.0 project aims to revolutionize this technology.

News | March 30, 2026

Unlocking the Circular Economy for Plastics

New EU Toolkit for Sustainable Electronics

The European research project INCREACE is setting a new milestone on the path to a truly circular economy: A consortium of universities, research institutions, and industry partners has created a comprehensive playbook and new assessment tool.

more about INCREACE

News | March 24, 2026

When seconds matter

Protecting AI data centers with nickel-zinc batteries

Supported by Fraunhofer IZM, the startup Zn2H2 has created an innovative and cost-effective way to produce nickel-zinc batteries. This type of battery is particularly suitable wherever large amounts of power are needed within a very short time. And they are the perfect choice for one specific market: AI data centers.

more info

News | March 05, 20226

Eric Fribourg-Blanc visits Fraunhofer IZM-ASSID

We are delighted to welcome Eric Fribourg-Blanc, Senior Program Officer at the Chips Joint Undertaking, to Fraunhofer IZM-ASSID on March 3, 2026. The program focused on an exchange of ideas on current projects and future topics of cooperation for establishing the APECS pilot line, as well as a tour of the clean room for cutting-edge 300-mm research.

more info

News | February 06, 2026

EU selects SUPREME consortium to develop the union’s superconducting technology for wider industrialization

The European Union has granted EUR 25 million to the SUPREME consortium, marking a significant milestone in industrialisation of superconducting quantum technologies across Europe.

more info

News

Events

Conference | May 5 – 7, 2026

iCCC 2026

The iCampus Cottbus Conference, which will take place from May 5-7, 2026, is dedicated to the role of sensor technology, MEMS & AI as key factors in structural change. The aim of the conference is to present current trends and research results in the field of microsensors for industrial applications and give the scientific community a chance to network.

iCCC 2026

Conference | May 26 – 29, 2026

ECTC 2026

The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology.

ECTC 2026

Exhibition | June 9 – 11, 2026

PCIM Expo & Conference

Fraunhofer IZM will be presenting technological highlights at PCIM 2026 (Power Conversion Intelligent Motion) in Nuremberg from June 9-11, 2026. The PCIM is the world's leading trade fair on the topics of power electronics, intelligent drive technology, renewable energies as well as energy management.

more info

Events

Promoting chiplet technologies

Fraunhofer IZM is an integral part of the APECS pilot line with the development of high-precision integration technologies, the prototyping of substrates and research into modular chiplet architectures.

www.apecs.eu

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

More info

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

Fraunhofer Institute for Reliability and Microintegration IZM

Green ICT: Efficient photoresist removal without toxic additives in a cleanroom

FIRST by FMD – Fast Innovation through Research in Semiconductor Technologies

Leveling up the electronics for e-mobility

Unlocking the Circular Economy for Plastics

When seconds matter: Protecting AI data centers with nickel-zinc batteries

Eric Fribourg-Blanc visits Fraunhofer IZM-ASSID

EU selects SUPREME consortium to develop the union’s superconducting technology for wider industrialization

The Science Year 2026 is dedicated to the medicine of the future.

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging from Wafer to System

Departments

News

FIRST by FMD – Fast Innovation through Research in Semiconductor Technologies

Leveling up the electronics for e-mobility

Unlocking the Circular Economy for Plastics

When seconds matter

Eric Fribourg-Blanc visits Fraunhofer IZM-ASSID

EU selects SUPREME consortium to develop the union’s superconducting technology for wider industrialization

News

Events

iCCC 2026

ECTC 2026

PCIM Expo & Conference

Events

Promoting chiplet technologies

Research Fab Microelectronics Germany

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

Fraunhofer IZM annual report & Brochure

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