 |
|
|
 |
 |
|
|
 |
|
|
|
|
|
|
|
|
|
SMT/HYBRID/PACKAGING 2010
June 2010
As every year, the SMT/HYBRID/PACKAGING in Nürnberg is our most important German event and an excellent opportunity to catch up with partners and customers from Germany and abroad. Further Information
Laser Optics Berlin 2010
22.-24. März 2010, Messe Berlin For the fifth time running Fraunhofer IZM will be exhibiting at the Laser Optics Berlin. Under the heading of Photonic Packaging optical and optoelectrical packaging and interconnection technologies will be presented. Further Information
|
|
|
|
Fraunhofer IZM's ZVE reaches final round of the dialogue forum Education-Science-Sustainability
November 2009
The dialogue forum Education-Science-Sustainability will be held in Berlin on November 30th. Taking the slogan “learning by doing”, the event is part of Berlin’s UN Decade of Education for Sustainable Development and will examine the contribution universities and research institutes... Further Information
First Elektronik ecodesign prize for his thesis about "Energy Harvesting in micro systems technologies“
November 2009
Stephan Benecke of TU Berlin has been awarded the first Elektronik ecodesign prize for his thesis about "Energy Harvesting in micro systems technologies“. This award, which was presented during the Elektronik ecodesign congress, is given for an exceptional masters thesis about “green” electronics. Further Information
|
|
|
|
Fraunhofer IZM scientists honoured with IMPACT Outstanding Paper Award second time in a row
October 2009
At the 4th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference in Taipei (Taiwan) Dionysios Manessis, Lars Boettcher, Andreas Ostmann, Stefan Karaszkiewicz and Herbert Reichl were honoured with the 2009 Outstanding Paper Award. Further Information
Tetris in the Kingdom of the Dwarves Drops of water used to place tiny components on nano-circuit boards
October 2009
The increasingly delicate electronic products that users enjoy are becoming more and more of a problem for microelectronics manufacturers. The capacity for accuracy of conventional pick-and-place machines reaches its limits just in the placing of such tiny components. Further Information
|
|
|
|
Linking Policy |
© 11/2009
Fraunhofer IZM |
Printable Version |
