Welcome - Fraunhofer IZM

High-End Performance Packaging from Wafer to System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

News

News | December 02, 2025

Drones can detect smoldering embers in forests

As part of the EU-funded PROACTIF project, 42 European partners from research and industry are collaborating with Nokia to develop a new multi-sensor system designed specifically for drones. The German consortium, led by Fraunhofer IZM, is developing an innovative multi-sensor module that automatically detects heat.

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News | November 14, 2025

Next-generation edge AI for Europe

The PREVAIL consortium makes future technology accessible

Many innovative European companies working on edge AI technologies have, until now, been dependent on international supply chains. To reduce this dependence, research organizations from four EU countries – including Fraunhofer – are setting up a European pilot line for next-generation edge AI technologies.

more info

News | November 12, 2025

Catching Heart Disease Early with AI-based Sensor System

It slips on like a normal vest: Fraunhofer IZM has created a smart sensor system in cooperation with the Charité and the Technical University of Berlin. The vest records a vast array of cardiovascular parameters, which an AI-based system uses to support medical diagnostics and spot potentially dangerous developments.

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News | October 30, 2025

Soft Interfaces

Textile-integrated light switches, made possible by printable Liquid Metal Ink

A gentle tap on the knitted lampshade is enough to switch on the light. The lamp developed by Fraunhofer IZM in cooperation with WINT Design Lab works with a revolutionary conductive ink. Visitors can find out more and try the lamp themselves at the Berlin Science Week on November 1st and 2nd.

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News | October 29, 2025

More than a once-over – Reusable packaging for a more sustainable food industry

PFABO and its innovative deposit and returns system is taking sustainability to the next level in the food industry. Its founders, Juliane and Adrian Spieker, and their team have not only developed a new type of packaging, but invented a complete system for reusable packaging.

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News | October 01, 2025

Prof. Ivan Ndip receives the Sidney J. Stein International Award 2025

On the occasion of the 58th International Symposium on Microelectronics (IMAPS Symposium 2025) in San Diego, CA, USA, Fraunhofer IZM department head Professor Ivan Ndip was honored with the Sidney J. Stein International Award 2025.

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News | October 01, 2025

Glass Panel Technology Group launched under the leadership of Fraunhofer IZM

By sharing technological expertise on TGVs and RDL on glass, 15 leading companies are driving forward the development of glass-based substrates. The kick-off event for the Glass Panel Technology Group took place on October 1, 2025, at Fraunhofer IZM in Berlin.

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News

Events

Promoting chiplet technologies

Fraunhofer IZM is an integral part of the APECS pilot line with the development of high-precision integration technologies, the prototyping of substrates and research into modular chiplet architectures.

www.apecs.eu

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

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Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

Fraunhofer Institute for Reliability and Microintegration IZM

Drones can detect smoldering embers in forests

From Lab to Car: Process Optimization for Automotive Chiplets

Next-generation edge AI for Europe

Catching Heart Disease Early with AI-based Sensor System

Soft Interfaces: Textile-integrated light switches, made possible by printable Liquid Metal Ink

More than a once-over – Reusable packaging for a more sustainable food industry

Prof. Ivan Ndip receives the Sidney J. Stein International Award 2025

Glass Panel Technology Group launched under the leadership of Fraunhofer IZM

Launch of the Competence Center Green ICT @ FMD

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging from Wafer to System

Departments

News

Drones can detect smoldering embers in forests

Next-generation edge AI for Europe

Catching Heart Disease Early with AI-based Sensor System

Soft Interfaces

More than a once-over – Reusable packaging for a more sustainable food industry

Prof. Ivan Ndip receives the Sidney J. Stein International Award 2025

Glass Panel Technology Group launched under the leadership of Fraunhofer IZM

News

Events

Events

Promoting chiplet technologies

Research Fab Microelectronics Germany

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

Fraunhofer IZM annual report & Brochure

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