Fraunhofer Institute for Reliability and Microintegration IZM

Fraunhofer Institute for Reliability and Microintegration IZM

Smart city on tablet with connected digital infrastructure shown at night
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Hardware-Software Co-Design for Energy-efficient IIoT Systems

REALIZM Blog | MAKING IDEAS HAPPEN

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v. l. n. r.: Prof. Klaus-Dieter Lang (ehem. IL IZM), Prof. Martin Schneider-Ramelow (IL IZM), Prof. Ulrike Ganesh (IL IZM), Prof. Albert Heuberger (IL IIS), Dr. Manuela Junghähnel (Standortleiterin IZM-ASSID), Dr. Stephan Guttowski (FMD), M. Jürgen Wolf (ehem. Standortleiter IZM-ASSID), Dr. Babett Gläser (SMWK), Dr. Christian Koitzsch (ESMC), Frank Bösenberg (Silicon Saxony e.V.)
© Christian Schneider-Bröcker | Fraunhofer IZM

15 years of Fraunhofer IZM-ASSID

The future of microelectronics shaped by Fraunhofer IZM’s Dresden site

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© Christian Schneider-Bröcker | Fraunhofer IZM

Energy label with additional information on durability, robustness, and reparability
© European Commission

New standards for durable electronics

The EU energy label for mobile devices

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© European Commission

v. l. n. r.: Dr. Nils F. Nissen; Prof. Dr. Ulrike Ganesh; Dr. Lutz Stobbe & Prof. Dr.-Ing. Martin Schneider-Ramelow
© Fraunhofer IZM | Enrica Theuke

Dr. Lutz Stobbe honored with the Fraunhofer IZM 2025 Research Award

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© Fraunhofer IZM | Enrica Theuke

© Piomic Medical AG

Fewer post-surgical infections with innovative therapeutic technology

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© Piomic Medical AG

Fraunhofer Mikroelektronik
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Launch of the Competence Center Green ICT @ FMD

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Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging vom Wafer zum System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration
System Integration & Interconnection Technologies
Environmental & Reliability Engineering
RF & Smart Sensor Systems

News

 

Fraunhofer IZM | November 06 - 07, 2025

Electronic Packaging Days 2025

On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration and to discuss these with partners.

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© Christian Schneider-Bröcker | Fraunhofer IZM

News | June 25, 2025

15 years of Fraunhofer IZM-ASSID

The future of microelectronics shaped by Fraunhofer IZM’s Dresden site
Since its foundation in 2010, the Fraunhofer IZM’s Saxon site has become a globally respected engine of innovation in 3D system integration and wafer-level packaging - and a crucial actor in Europe’s high-technology ecosystem.

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© European Commission

News | June 17, 2025

New standards for durable electronics: The EU energy label for mobile devices

A new energy label for mobile devices will be mandatory in the EU starting June 20, 2025. This applies to all smartphones and tablets with Android or iPadOS operating systems, ushering in a new era of European product policy.

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© Fraunhofer IZM | Enrica Theuke

News | June 12, 2025

Dr. Lutz Stobbe honored with the Fraunhofer IZM 2025 Research Award

Measurable data and narrated stories for sustainable microelectronics - For his pioneering research in sustainable information and communication technologies (ICT) the Fraunhofer Institute for Reliability and Microintegration IZM honors Dr. Lutz Stobbe with the 2025 Research Award.

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© Piomic Medical AG

News | June 03, 2025

Fewer post-surgical infections with innovative therapeutic technology

A novel way to manage infected wounds and a truly customized treatment without need for antibiotics: That is the idea behind a new medical technology project supported by the Federal Ministry of Education and Research, including the Fraunhofer Institute for Reliability and Microintegration IZM among the research partners.

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© Fraunhofer IZM-ASSID | C. Fiedler

News | May 27, 2025

Towards next-generation edge-AI technologies: EU consortium opens services to external customers

The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will open its services to external customers in June 2025. 

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News

Events

 

© Adobe Stock | metamorworks

Workshop | October 14 - 16, 2025

Fundamental radar signal processing in MATLAB based on TI Radars

Fraunhofer IZM offers a radar workshop based on a Texas Instruments (TI)-Ecosystem. The workshop focuses on signal processing of radar systems, especially for the IWR6843. It contains a theoretical and a practical part of 4 hours each.

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Change Hub Berlin | October 15 - 16, 2025

Green ICT Connect 2025

To promote an exchange between science, industry and politics on the topic of resource conservation in ICT, high-ranking representatives will meet for the third time at the conference for resource-conscious information and communication technologies »Green ICT Connect 2025«.

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Events

 

© Leistungszentrum Digitale Vernetzung

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

 

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

 

© Fraunhofer IZM | Volker Mai

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

 

© Kai Abresch photography

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

 

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

 

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

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