Newsletter Sign-up

If you would like to be informed about past and upcoming events and trade fairs via email please fill in the following form. You then will immediately receive a reply with a confirmation link which you please click in order to confirm your sign up. With only a few clicks you may unsubsribe from this service via our online system at any time.

Please select at least one field of interest for which you would like to receive information via mail in the future:

please mark one or more checkboxes

TechNews:
Receive a quarterly overview of the latest press releases and exclusive insights into the fields of advanced packaging, chiplets, and heterogeneous integration.

Events:
Get regular updates on trade shows, events, and workshops where you can meet us or that we are organizing.

RealIZM – Electronic Packaging Blog:
Every three weeks, discover the latest developments in electronic packaging through engaging articles—from chiplets and reliability to hardware security.

System Reliability and Failure Mechanisms:
Receive information twice a year about events related to system reliability and failure mechanisms in electronic systems.

Electronics Goes Green:
Receive information four times a year about events related to sustainable electronics.

TechNews

Events

RealIZM – Electronic Packaging Blog

System Reliability and Failure Mechanisms

Electronics Goes Green

TechNews:
Receive a quarterly overview of the latest press releases and exclusive insights into the fields of advanced packaging, chiplets, and heterogeneous integration.

Events:
Get regular updates on trade shows, events, and workshops where you can meet us or that we are organizing.

RealIZM – Electronic Packaging Blog:
Every three weeks, discover the latest developments in electronic packaging through engaging articles—from chiplets and reliability to hardware security.

System Reliability and Failure Mechanisms:
Receive information twice a year about events related to system reliability and failure mechanisms in electronic systems.

Electronics Goes Green:
Receive information four times a year about events related to sustainable electronics.

to complete your newsletter submission please fill in your email address

e-Mail

Please enter only one email address.

Please chose a salutation!

salutation

So that we can address you appropriately!

first name

Please let us know your surname

surname

required

Bitte füllen Sie das Pflichtfeld aus.

company/institution

Bitte füllen Sie das Pflichtfeld aus.

country

So that we can send you information relevant to your region!

Bitte füllen Sie das Pflichtfeld aus.

preferred newsletter language

So that we can provided our newsletter in your preferred language.

German

English

So that we can provided our newsletter in your preferred language.

Please agree to our privacy policy in order to proceed.

Data Protection

I agree that Fraunhofer IZM may store the data I have provided and use it to send me information via email regarding its research activities and services. Any use of personal data will be limited to the stated purpose and to the extent necessary to achieve that purpose. Fraunhofer IZM processes and stores personal data collected in connection with the provision of our newsletters in compliance with applicable data protection regulations. Fraunhofer IZM notes that you may revoke your consent to the use of your data at any time by sending an email to info@izm.fraunhofer.de. You can also unsubscribe from the emails by clicking the unsubscribe link at the bottom of each email.

Contact Press / Media

Georg Weigelt