Interposer Module

Exhibit by IZM-ASSID

  • Integration of inertial sensor and ASIC integration on 2.5D Interposer
  • Silicon Interposer for decoupling MEMS device and ASIC
  • Interposer and devices assembeld on organic board
  • Improves sensor accuracy by noise reduced analog signaling
  • Realized within the project SIMEIT (funded by the Free State of  Saxony)
  • Mounted on laminate package board