Assembly can be offered chip-to-chip or chip-to-substrate (e.g. laminates, thinfilm ceramics). Chip-to-wafer assembly especially dedicated for 3D integration is possible for wafers up to 300 mm in diameter. Beside permanent die attach we also developed temporary die bonding methods to form artificial reconfigured wafers for wafer-to-wafer bonding. Solutions for thin chip handling have been developed as well as for very small chips by collective bonding methods.