Within the European project CarrICool, processes and technologies for the smart implementation and the robust manufacturability of advanced More-than-Moore components into a modular and scalable interposer, supporting System-on-Chip and System-in-Package evolution. These new packaging solutions are crucial for the realization of 3D integration density scaling and beyond-CMOS devices, constraining systemability with respect to energy efficiency, reliability, and  computational performance – the key metrics in the many-core, exascale and post-CMOS era.

The 9 participating research and industry partners represent six European countries. The project is funded by the European Union with around four Million Euro. It started in January 2014 and runs for three years.

Modular Interposer Architecture

  • Silicon interposer with fluid cavities: CTE matching and high wiring density
  • High temperature stable interconnects and sealing rings: Cu-Sn TLPB or Au-Sn TLPB or Cu-Cu TC bonding
  • Self-alignment of photonic IC and polymer waveguide for silicon photonics

  • IBM Research GmbH (Switzerland)
  • Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung e.V. (Germany)
  • Technical University of Chemnitz (Germany)
  • Tyndall National Institute, University College Cork (Ireland)
  • STMicroelectronics (Italy)
  • Optocap Ltd (United Kingdom)
  • IPDIA (France)
  • Eidgenoessische Technische Hochschule Zuerich (Zwitzerland)
  • Institute of Electron Technology (Poland)
  • AMIC Angewandte Micro-Messtechnik GmbH (Germany)


Interposer Infrastructure
CarrICool Self-Alignment

Allgemeine Projektinformationen

  • Framework/Project Objective:  FP7-ICT-2013.3.1 (Nanoelectronics)
  • Project number:   619488
  • Project start:   01.01.2014
  • Duration:   2 years