Within the European project CarrICool, processes and technologies for the smart implementation and the robust manufacturability of advanced More-than-Moore components into a modular and scalable interposer, supporting System-on-Chip and System-in-Package evolution. These new packaging solutions are crucial for the realization of 3D integration density scaling and beyond-CMOS devices, constraining systemability with respect to energy efficiency, reliability, and computational performance – the key metrics in the many-core, exascale and post-CMOS era.
The 9 participating research and industry partners represent six European countries. The project is funded by the European Union with around four Million Euro. It started in January 2014 and runs for three years.