ECTC - Fraunhofer IZM

Konferenz / 30. Mai 2023 - 02. Juni 2023

ECTC - 2023 IEEE 73rd Electronic Components and Technology Conference

Die Electronic Components and Technology Conference (ECTC) ist eine der weltweit wichtigsten Veranstaltungen im Bereich der Aufbau- und Verbindungstechnik und Mikrosystemtechnik.

In diesem Jahr findet die Konferenz vom 30. Mai bis zum 2. Juni 2023 in Orlando, Florida statt. Das Fraunhofer IZM wird auf der begleitenden Fachausstellung aktuelle Trends aus dem Bereich des Electronic Packaging präsentieren.

Das Fraunhofer IZM ist mit insgesamt zehn Vorträgen vertreten.

Veranstaltungsdetails

Veranstaltungsort

JW Marriott
Orlando, Grande Lakes, Florida

Datum

30. Mai 2023 - 02. Juni 2023

Diesen Termin als iCal herunterladen

Technical Presentations

Session 4: Assembly and Manufacturing Process Enhancement

Topic: Assembly and Manufacturing Technology

Wednesday May 31st 9:30 AM — 12:35 PM

2. Optimum Rc Control and Productivity Boost in Wafer-Level-Packaging Enabled by High-Throughput UBM/RDL Technology

Kay Viehweger (Fraunhofer IZM)
Carl Drechsel, Patrik Carazzetti, Carl Wang, Juergen Weichart, Ewald Strolz (alle Evatec AG)

Link: https://ectc.net/program/session4.cfm

Session 6: Co-packaged Optical Assembly

Topic: Photonics

Wednesday May 31st 9:30 AM — 12:35 PM

3. Photonic System Integration by Applying Microelectronic Packaging Approaches Using Glass Substrates

Henning Schroeder & Oliver Kirsch (Fraunhofer IZM)
Daniel Weber (Technical University Berlin)
Hendrick Thiem (TOPTICA eagleyard)

Link: https://ectc.net/program/session6.cfm

Session 37: Interactive Presentations 1
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers

Wednesday May 31st, 10:00 AM - 12:00 PM

Kai Zoschke, Charles-Alix Manier & Hermann Oppermann (Fraunhofer IZM)
Dirk Meier & Nishant Malik (Integrated Detector Electronic AS)
Elahe Zakizade & Marvin Daniel Michel (Fraunhofer IMS)
Avisek Roy, Hoang-Vu Nguyen & Hexin Xia (University of South-Eastern Norway)

Link: https://ectc.net/program/session37.cfm

Session 7: Large Formfactor Dense System Integration by FanOut

Topic: Packaging Technologies

Wednesday May 31st 2:00 PM — 5:05 PM

1. 3D Freeform Antenna-in-Package Approach for FOWLP

Tanja Braun, Tina Thomas, Karl-Friedrich Becker, Thi Huyen Le, Christian Tschoban, Rolf Aschenbrenner, Martin Schneider-Ramelow

Link: https://ectc.net/program/session7.cfm

Session 18: Advanced Photonic Packaging and Interconnect

Topic: Photonics

Thursday June 1st 9:30 AM — 12:35 PM

4. Packaging of Ultra-Dynamic Photonic Switches and Transceivers for Integration Into 5G Radio Access Network and Datacenter Sub-systems

Geert Van Steenberge, Gunther Roelkens, Peter Ossieur, Jeroen Missinne (imec/Ghent University)
Joris Van Campenhout (imec)
Milan M. Milosevic (PHIX Photonics Assembly)
Paraskevas Bakopoulos (NVIDIA)
Igor Krestnikov (Innolume)
Stefano Stracca (Ericsson Research)
Tanja Joerg (AT&S AG)
Tanja Braun (Fraunhofer IZM)
Qixiang Cheng (Cambridge University

6. Realization, Multi-Field Coupled Simulation and Characterization of a Thermo-Mechanically Robust LiDAR Front End on a Copper Coated Glass Substrate

Marcel Kettelgerdes, Amit Pandey & Gordon Elger (Technical University of Applied Science Ingolstadt)
Peter Meszmer, Majid Tavakolibasti & Bernhard Wunderle (Chemnitz University of Technology)
Gunnar Boettger (Fraunhofer IZM)
Hueseyin Erdogan (Continental AG)

Link: https://ectc.net/program/session6.cfm

Session 21: Fine-Pitch and Intermetallic Considerations in Advanced Solder Interconnections

Topic: Interconnections

Thursday June 1st 2:00 PM — 5:05 PM

3. Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications

Gaurav Khurana (Dresden University of Technology)
Iuliana Panchenko (Fraunhofer IZM)

Link: https://ectc.net/program/session21.cfm

Session 30: Trends in Encapsulants and Low Dk/Df Dielectrics

Topic: Materials & Processing

Friday June 2nd 9:30 AM — 12:35 PM

Session Co-Chair

Tanja Braun (Fraunhofer IZM) & Kimberly Yess (Brewer Science, Inc.)

Link: https://ectc.net/program/session30.cfm

Session 31: MEMS Sensor, Bio, and Advanced Interconnect Reliability

Topic: Packaging Technologies | Applied Reliability

Friday June 2nd 2:00 PM — 5:05 PM

3. A Novel FOWLP Method to Integrate Delicate MEMS Components

Markus Woehrmann, Marc Dreissigacker, Tanja Braun, Michael Schiffer, Martin Schneider-Ramelow

Link: https://ectc.net/program/session31.cfm

Session 32: Thermo-Mechanical Modelling and Characterization

Topic: Thermal/Mechanical Simulation & Characterization

Friday June 2nd 2:00 PM — 5:05 PM

5. Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology

Saskia Gesche Huber, Andreas Stegmaier, Marius van Dijk, Nina Nguyen, Ole Hoelck, Olaf Wittler, Martin Schneider-Ramelow

Link: https://ectc.net/program/session32.cfm

Session 33: Advances in RDL, Via, and TSV Technologies for Chiplet Integration

Topic: Interconnections

Friday June 2nd 2:00 PM — 5:05 PM

1. 3D Silicon Interposer for Terabit/s Transciever Based on High-Speed TSVs

Bogdan Sirbu, Kai Zoschke & Tolga Tekin (Fraunhofer IZM)
Ukyo Suzuki & Quentin Wilmart (CEA-LETI)

Link: https://ectc.net/program/session33.cfm

Messen, Konferenzen, Veranstaltungen

Konferenz / 30. Mai 2023 - 02. Juni 2023

ECTC - 2023 IEEE 73rd Electronic Components and Technology Conference

Weitere Informationen

Veranstaltungsdetails

Veranstaltungsort

Technical Presentations

Session 4: Assembly and Manufacturing Process Enhancement

2. Optimum Rc Control and Productivity Boost in Wafer-Level-Packaging Enabled by High-Throughput UBM/RDL Technology

Session 6: Co-packaged Optical Assembly

3. Photonic System Integration by Applying Microelectronic Packaging Approaches Using Glass Substrates

Session 37: Interactive Presentations 1
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers

Session 7: Large Formfactor Dense System Integration by FanOut

1. 3D Freeform Antenna-in-Package Approach for FOWLP

Session 18: Advanced Photonic Packaging and Interconnect

4. Packaging of Ultra-Dynamic Photonic Switches and Transceivers for Integration Into 5G Radio Access Network and Datacenter Sub-systems

6. Realization, Multi-Field Coupled Simulation and Characterization of a Thermo-Mechanically Robust LiDAR Front End on a Copper Coated Glass Substrate

Session 21: Fine-Pitch and Intermetallic Considerations in Advanced Solder Interconnections

3. Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications

Session 30: Trends in Encapsulants and Low Dk/Df Dielectrics

Session 31: MEMS Sensor, Bio, and Advanced Interconnect Reliability

3. A Novel FOWLP Method to Integrate Delicate MEMS Components

Session 32: Thermo-Mechanical Modelling and Characterization

5. Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology

Session 33: Advances in RDL, Via, and TSV Technologies for Chiplet Integration

1. 3D Silicon Interposer for Terabit/s Transciever Based on High-Speed TSVs

Contact Press / Media

Susann Thoma

Konferenz / 30. Mai 2023 - 02. Juni 2023

ECTC - 2023 IEEE 73rd Electronic Components and Technology Conference

Veranstaltungsdetails

Veranstaltungsort

Technical Presentations

Session 4: Assembly and Manufacturing Process Enhancement

2. Optimum Rc Control and Productivity Boost in Wafer-Level-Packaging Enabled by High-Throughput UBM/RDL Technology

Session 6: Co-packaged Optical Assembly

3. Photonic System Integration by Applying Microelectronic Packaging Approaches Using Glass Substrates

Session 37: Interactive Presentations 1Wafer Level Capping Technology for Vacuum Packaging of Microbolometers

Session 7: Large Formfactor Dense System Integration by FanOut

1. 3D Freeform Antenna-in-Package Approach for FOWLP

Session 18: Advanced Photonic Packaging and Interconnect

4. Packaging of Ultra-Dynamic Photonic Switches and Transceivers for Integration Into 5G Radio Access Network and Datacenter Sub-systems

6. Realization, Multi-Field Coupled Simulation and Characterization of a Thermo-Mechanically Robust LiDAR Front End on a Copper Coated Glass Substrate

Session 21: Fine-Pitch and Intermetallic Considerations in Advanced Solder Interconnections

3. Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications

Session 30: Trends in Encapsulants and Low Dk/Df Dielectrics

Session 31: MEMS Sensor, Bio, and Advanced Interconnect Reliability

3. A Novel FOWLP Method to Integrate Delicate MEMS Components

Session 32: Thermo-Mechanical Modelling and Characterization

5. Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology

Session 33: Advances in RDL, Via, and TSV Technologies for Chiplet Integration

1. 3D Silicon Interposer for Terabit/s Transciever Based on High-Speed TSVs

Session 37: Interactive Presentations 1
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers