Die Electronic Components and Technology Conference (ECTC) ist eine der weltweit wichtigsten Veranstaltungen im Bereich der Aufbau- und Verbindungstechnik und Mikrosystemtechnik. Die 71. ECTC-Konferenz findet vom 01. Juni bis 04. Juli 2021 online statt.
http://www.ectc.net/index.cfm
01. Juni 2021 - 04. Juli 2021
Session 1: 2D and 3D Chiplets Interconnects in FO-WLP/PLP
7. Enabling D2W / D2D Hybrid Bonding on Manufacturing Equipment Based on Simulated Process Parameters
Session 39: High-Speed Channel Design, Power Delivery and Analysis
9. The Impact of Ageing on the Dielectric Properties of Laminates for Automotive Radar
Session 40: Materials and Techniques in High-Speed Interconnects
9. Advances in Dry Etch Processing for High-Density Vertical Interconnects in Fan-Out Panel-Level Packaging and IC Substrates
Session 42: Topics in Advanced Packaging
5. Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach
Session 44: Thermo-Mechanical Analysis for Reliability in Packaging Technology
8. Process Dependent Material Characterization for Warpage Control of Fan-Out Wafer Level Packaging
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM