Tuesday, May 30, 2023, 8:00 AM – 12:00 Noon
Course Leaders: Ivan Ndip – Fraunhofer IZM / Brandenburg University of Technology and Markus Wöhrmann – Fraunhofer IZM
Due to their myriad of advantages in system-integration, fan-out wafer/panel-level packages (FO WLPs/PLPs) and other advanced RF packages (e.g., glass interposers and chip-embedding packages) will play a key role in the development of emerging electronic systems. The fabrication processes and RF performance of these packages will contribute significantly to the cost and performance of the entire system. The objective of this course is to provide and illustrate the fundamentals of the fabrication processes and RF design of these advanced packages for emerging RF/wireless applications. An overview of distinct types of wafer-level packages, fan-out technologies, glass interposers and chip-embedding packages will first be given. This will be followed by a presentation of new fan-out-packaging and interposer-based concepts for emerging and future applications (e.g., 5G mmWave, mmWave radar sensors, 6G) as well as a thorough discussion of the materials and fabrication processes of FO-WLPs/PLPs, multilayered RDLs, glass interposers and chip embedding packages. The basics of efficient RF design and measurement of the fundamental building blocks of these advanced packages will be given for frequencies up to the millimeter-wave range. Finally, examples of these advanced packages designed and fabricated at Fraunhofer IZM will be discussed.
Course Outline:
- Overview: Different Types of Wafer-level Packages, Fan-out Technologies, and Advanced RF Packages
- Requirements of 5G Packaging and New Fan-out Packaging Concepts for 5G mmWave Applications
- Materials and Fabrication Processes:
FO-WLPs/PLPs, Multi-layered RDLs, Glass
Interposers and Chip Embedding Packages
- Fundamentals of RF Design and Measurement: FO-WLPs/PLPs, Glass Interposers and Chip-Embedding Packages
- Examples of Advanced Packages Designed and Fabricated at Fraunhofer IZM
Who Should Attend:
Engineers, scientists, researchers, designers, managers, and graduate students interested in the fundamentals of electronic packaging as well as those involved in the process of electrical design, layout, processing, fabrication and/or system-integration of electronic packages for emerging applications (e.g., 5G, 6G, mmwave radar sensors) should attend.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM