Session 4: Advances in Fan-Out Panel Level Packaging
1. Panel Level Packaging – Where are the Technology Limits?
- Tanja Braun, Ole Hölck, Mattis Obst, Steve Voges, Ruben Kahle, Lars Böttcher, Mathilde Billaud, Karl-Friedrich Becker, Rolf Aschenbrenner - Fraunhofer IZM
- Marcus Voitel - Technische Universität Berlin
Session 40: Materials, Techniques and Modelling for High Speed Interconnects
13. Dry Etch Processing in Fan-Out Panel-Level Packaging - An Application for High-Density Vertical Interconnects and Beyond
- Friedrich-Leonhard Schein, Christian Voigt - Technische Universität Berlin
- Ioannis Tsigaras - Evatec AG
- Lutz Gerhold - Technische Universität Berlin
- Mohamed Elghazzali - Evatec AG
- Ruben Kahle - Fraunhofer IZM
- Hirofumi Sawamoto - Evatec AG
- Ewald Strolz - Evatec AG
- Lars Böttcher - Fraunhofer IZM
- Roland Rettenmeier - Evatec AG
Session 23: Advanced Processes for Manufacturing and Yield Enhancement
5. High Density Thin Film Flex Technology for Advanced Packaging Applications
- Kai Zoschke, Hermann Oppermann, Markus Wöhrmann, Christine Kallmayer, Christian Tschoban, Kevin Kröhnert, Christina Lopper, Danny Jaeger, Mario Lutz, Olaf Wünsch - Fraunhofer IZM
Session 15: Enhancements in Fine-Pitch Interconnects, Redistribution Layers and Through-Vias
4. Fabrication and Characterization of Nanoporous Gold (NPG) Interconnects for Wafer Level Packaging
- Lothar Dietrich, Hermann Oppermann, Christina Lopper, Piotr Mackowiak - Fraunhofer IZM
Session 17: Processing Enhancements in Fan-Out and Heterogeneous Integration
4. A Novel Tool Concept for Electroplating of Advanced Panel Level Packaging Designs
- Norbert Bay - RENA Technologies GmbH
- Ruben Kahle - Fraunhofer IZM
- John Burschik, Konrad Kaltenbach, Valeria Samsoninkova, Holger Kuehnlein - RENA Technologies GmbH
Session 19: Novel Characterization Techniques and Test Methods
7. A Novel Quantitative Adhesion Measurement Method for Thin Polymer and Metal Layers for Microelectronic Applications
- Markus Woehrmann, Michael Schiffer - Fraunhofer IZM
- Martin Schneider-Ramelow - Fraunhofer IZM / Technische Universität Berlin
- Klaus-Dieter Lang, Piotr Mackowiak - Fraunhofer IZM
Session 37: Reliability Analysis of New Materials in Modern Packaging (POSTER)
25. Design for Reliability of Power Module Packaging Design Options
- Marius van Dijk, Olaf Wittler - Fraunhofer IZM
- Ping-Chi Hung - Universal Scientific Industrial Co., Ltd.
- Willy H. Lai - Advanced Semiconductor Engineering, Inc.
- C. Y. Hsieh - Advanced Semiconductor Engineering, Inc.
- Thomas Wang - Advanced Semiconductor Engineering, Inc.
- Martin Schneider-Ramelow - Fraunhofer IZM / Technische Universität Berlin
Session 40: Materials, Techniques and Modelling for High Speed Interconnects (POSTER)
13. Dry Etch Processing in Fan-Out Panel-Level Packaging - An Application for High-Density Vertical Interconnects and Beyond
- Friedrich-Leonhard Schein - Technische Universität Berlin
- Christian Voigt - Technische Universität Berlin
- Ioannis Tsigaras - Evatec AG
- Lutz Gerhold - Technische Universität Berlin
- Mohamed Elghazzali - Evatec AG
- Ruben Kahle - Fraunhofer IZM
- Hirofumi Sawamoto - Evatec AG
- Ewald Strolz - Evatec AG
- Lars Böttcher - Fraunhofer IZM
- Roland Rettenmeier - Evatec AG
Professional Development Courses
3. Fundamentals of RF Design and Fabrication Processes of Fan-Out Wafer/Panel Level Packages and Interposers
Morning courses 8:00 AM – 12:00PM
Course Leaders: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM
10. From Wafer to Panel Level Packaging
Afternoon courses 1:15 AM – 5:15PM
Course Leaders: Tanja Braun – Fraunhofer IZM and Michael Töpper – Fraunhofer Reseacrh Fab Microelectronics Germany
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM