ECTC - Fraunhofer IZM

Konferenz / 27. Mai 2025 - 30. Mai 2025

ECTC - 2025 IEEE 75th Electronic Components and Technology Conference

Die Electronic Components and Technology Conference (ECTC) ist eine der weltweit wichtigsten Veranstaltungen im Bereich der Aufbau- und Verbindungstechnik und Mikrosystemtechnik.

In diesem Jahr findet die Konferenz vom 27. Mai bis zum 30. Mai 2025 in Dallas, Texas statt. Das Fraunhofer IZM wird auf der begleitenden Fachausstellung aktuelle Trends aus dem Bereich des Electronic Packaging präsentieren.

Das Fraunhofer IZM ist mit zahlreichen Vorträgen und zwei Special Sessions vertreten.

Veranstaltungsdetails

Veranstaltungsort

Gaylord Texan Resort & Convention Center
1501 Gaylord Trial
Grapevine, Texas, USA, 76051

Datum

27. Mai 2025 - 30. Mai 2025

Diesen Termin als iCal herunterladen

Treffen Sie Fraunhofer IZM-Experten auf der ECTC 2025

Professional Development Course (PDC)

Fraunhofer IZM Instructors

Tuesday, May 27, 8:00 AM - 12:00 PM

From Wafer to Panel Level Packaging
PDC Instructors:Tanja Braun and Piotr Mackowiak, Fraunhofer IZM | more

Tuesday, May 27, 8:00 AM - 12:00 PM

Fundamentals of Fabrication Processes and RF Design of Advanced Packages including Fan-Out, Chiplets, Glass and Polymer Interposers
PDC Instructors: Ivan Ndip, Brandenburg University of Technology/ Fraunhofer IZM and Markus Wöhrmann, Fraunhofer IZM | more

Special Session

Fraunhofer IZM Session Chair

Tuesday, May 27, 3:30 PM - 5:00 PM

Advancements in mmWave and Sub-THz Packaging for Communication and Radar Applications
Session Chairs: Ivan Ndip, Brandenburg University of Technology/ Fraunhofer IZMand Maciej Wojnowski, Infineon Technologies AG | more

Electrical Design and Analysis

Fraunhofer IZM Session Chair

Wednesday, May 28, 9:30 AM - 12:35 PM

Advanced Design for Heterogeneous Integration
Session Chairs: Ivan Ndip, Brandenburg University of Technology/ Fraunhofer IZM and Li-Cheng Shen (Miniaturization Competence Center (MCC), USI) | more

Applied Reliability

Oral Presentation by Fraunhofer IZM expert

Friday, May 30, 09:50 AM - 10:10 AM

Influence of Passivation Layer on Electromigration Lifetime of Fine-Pitch Cu RDL (Part of Session 28 Reliability of Heterogeneous Integrated (HI) Packages)
Authors: Adrija Chaudhuri, Johannes Jaeschke, Astrid Gollhardt, Hermann Oppermann and Martin Schneider-Ramelow, Fraunhofer IZM | more

Electrical Design and Analysis

Oral Presentation by Fraunhofer IZM expert

Friday, May 30, 04:05 PM - 04:25 PM

Electrical Design and Analysis: Integration of D-Band 140 GHz III-V Components Transceiver in Embedding PCB-Based Technology (Part of Session 35 High -Performance Antenna and RF Design)
Authors: Tekfouy Lim, Stefan Kosmider, Kavin Senthil Murugesan, Thi Huyen Le, Marius Van Dijk, Johannes Jaeschke, Ivan Ndip and Ulrike Ganesch, Fraunhofer IZM | more

Präsentationen mit Fraunhofer IZM Co-Autoren

Photonics

Oral Presentation

Wednesday, May 28, 11:35 AM - 11:55 AM

Large-Scale Glass Waveguide Circuit for Board-Level Optical Interconnects Between Faceplate and Co-Packaged Optical Transceivers (Part of Session 02 Co-Packaged Optics)
Authors: Lars Bruisberg, Betsy Johnson, Jason Grenier, Julian Schwietering, Christian Herbst, Matthew Dejneka, Chad Terwilliger, Henning Schroeder | more

Interactive Presentation

Thursday, May 29, 10:00 AM - 12:00 PM

Fabrication of D-band (140 GHz) Broadband Antenna Using Quartz Glass on Silicon Hybrid Bonded Wafer With Cavity
Authors: Kentaro Tani, Naotake Okada, Masato Tokai, Shoichiro Yamaguchi, Jungo Kondo, Makoto Iwai, Uwe Maaß, Alexander Gäbler, Wojciech Partyka, Ivan Ndip | more

Materials & Processing

Oral Presentation

Friday, May 30, 10:10 AM - 10:30 AM

Materials & Prozessing: Characterization of PVD Backside Metal Adhesion for Improved Thermal Management in Heterogeneous Integration (Part of Session 27 Thermal Management and Material Solutions for High Performance 2.5D and 3D Packaging)
Authors: Carl Dechsel, Patrik Carazzetti, Eleftherios Stampolis, Roland Rettenmeier, Ole Hoelck, Marcus Voitel, Friedrich Müller, Karl-Friedrich Becker | more

Messen, Konferenzen, Veranstaltungen

Konferenz / 27. Mai 2025 - 30. Mai 2025

ECTC - 2025 IEEE 75th Electronic Components and Technology Conference

Weitere Informationen

Veranstaltungsdetails

Veranstaltungsort

Treffen Sie Fraunhofer IZM-Experten auf der ECTC 2025

Professional Development Course (PDC)

Special Session

Electrical Design and Analysis

Applied Reliability

Electrical Design and Analysis

Präsentationen mit Fraunhofer IZM Co-Autoren

Photonics

Interactive Presentation

Materials & Processing

Contact Press / Media

Claudia Brall