Messen, Konferenzen, Veranstaltungen
Die Electronic Components and Technology Conference (ECTC) ist eine der weltweit wichtigsten Veranstaltungen im Bereich der Aufbau- und Verbindungstechnik und Mikrosystemtechnik.
In diesem Jahr findet die Konferenz vom 26. Mai bis zum 29. Mai 2026 in Orlando, Florida statt. Das Fraunhofer IZM wird auf der begleitenden Fachausstellung aktuelle Trends aus dem Bereich des Electronic Packaging präsentieren.
JW Marriott & The Ritz-Carlton Grande Lakes Resort
4040 Central Florida Parkway,
Orlando, Florida, USA, 32837
26. Mai 2026 - 29. Mai 2026
Fraunhofer IZM Instructors
PDC 03: From Wafer to Panel Level Packaging (Texas 6)
Course Leaders: Tanja Braun and Piotr Mackowiak, Fraunhofer IZM
PDC 07: Fundamentals of Fabrication Processes and RF Design of Advanced Packages including Fan-Out, Chiplets, Glass and Polymer Interposers (San Antonio 5-6)
Course Leaders: Ivan Ndip, Fraunhofer IZM/Brandenburg University of Technology and Markus Wöhrmann, Fraunhofer IZM
Session 05: RF and High-Speed Design for mmWave and Sub-THz (Tuscany A-C)
Differentially Fed Sub-THz Broadband Antenna Arrays Using Quartz Glass Cavity-Backed Bonding Technology
Speaker: Dr. Alexander Gäbler, Fraunhofer IZM
Session 38: Photonics, mmWave Applications, and EmergingTechnologies (IP Space)
Monolithic Passive Low-Loss Fiber Coupling to Photonic Glass Core Substrates Using Ion-Exchanged Waveguides and SLE-Fabricated V-Grooves
Speaker: Maurice Haffner, Fraunhofert IZM
Further sessions with Fraunhofer IZM participation ( 3:30 p.m. — 5 p.m., Texas C)
Special Session 7: Advancements in mmWave and Sub-THz Packaging for Communication and Radar Applications
Co-Chair/ Intro: Prof. Ivan Ndip, Fraunhofer IZM
Fraunhofer IZM Instructors
Session 40: Interactive Presentations - Materials, Manufacturing, and Assembly Techniques in Advanced Packaging Solutions (IP Space)
Technology for Sequential Integration of HPA and LNA on Stacked GaN Layers for 3D Packaging of Next Gen Miniaturized Power RF Transceiver Front Ends
Speaker: Kai Zoschke, Fraunhofer
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM