ECTC - 2026 IEEE 76th Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. This year’s conference will be taking place from May 26 to May 29, 2026 in Orlando, Florida. Fraunhofer IZM will present current trends in the field of electronic packaging at the accompanying trade exhibition.