ECTC 2023 IEEE 73rd Electronic Components and Technology Conference

Conference / May 30, 2023 - June 02, 2023

ECTC - 2023 IEEE 73rd Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. This year’s conference will be taking place from May 30 to June 2, 2023 in Orlando, Florida. Fraunhofer IZM will present current trends in the field of electronic packaging at the accompanying trade exhibition.

With several oral presentations and two special-sessions in the conference program Fraunhofer IZM scientists will be out in force to showcase the institute’s expertise in all areas of microelectronic packaging.

Event details

Location

JW Marriott
Orlando, Grande Lakes, Florida

Date

May 30, 2023 - June 02, 2023

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Technical Presentations

Professional Development Courses

Fundamentals of RF Design and Fabrication Processes of Fan-out Wafer/Level and Advanced RF Packages

Tuesday, May 30, 2023, 8:00 AM – 12:00 Noon

Course Leaders: Ivan Ndip – Fraunhofer IZM / Brandenburg University of Technology and Markus Wöhrmann – Fraunhofer IZM

Due to their myriad of advantages in system-integration, fan-out wafer/panel-level packages (FO WLPs/PLPs) and other advanced RF packages (e.g., glass interposers and chip-embedding packages) will play a key role in the development of emerging electronic systems. The fabrication processes and RF performance of these packages will contribute significantly to the cost and performance of the entire system. The objective of this course is to provide and illustrate the fundamentals of the fabrication processes and RF design of these advanced packages for emerging RF/wireless applications. An overview of distinct types of wafer-level packages, fan-out technologies, glass interposers and chip-embedding packages will first be given. This will be followed by a presentation of new fan-out-packaging and interposer-based concepts for emerging and future applications (e.g., 5G mmWave, mmWave radar sensors, 6G) as well as a thorough discussion of the materials and fabrication processes of FO-WLPs/PLPs, multilayered RDLs, glass interposers and chip embedding packages. The basics of efficient RF design and measurement of the fundamental building blocks of these advanced packages will be given for frequencies up to the millimeter-wave range. Finally, examples of these advanced packages designed and fabricated at Fraunhofer IZM will be discussed.

Course Outline:

Overview: Different Types of Wafer-level Packages, Fan-out Technologies, and Advanced RF Packages
Requirements of 5G Packaging and New Fan-out Packaging Concepts for 5G mmWave Applications
Materials and Fabrication Processes:
FO-WLPs/PLPs, Multi-layered RDLs, Glass
Interposers and Chip Embedding Packages
Fundamentals of RF Design and Measurement: FO-WLPs/PLPs, Glass Interposers and Chip-Embedding Packages
Examples of Advanced Packages Designed and Fabricated at Fraunhofer IZM

Who Should Attend:
Engineers, scientists, researchers, designers, managers, and graduate students interested in the fundamentals of electronic packaging as well as those involved in the process of electrical design, layout, processing, fabrication and/or system-integration of electronic packages for emerging applications (e.g., 5G, 6G, mmwave radar sensors) should attend.

Special Session: Advanced Packaging for Harsh Environments

Advanced Packaging and Heterogeneous Integration Roadmap for Harsh Environment – Current Status and Opportunities

Tuesday, May 30, 2023, 8:30 AM – 10:00 AM

Chairs: Tanja Braun, Fraunhofer IZM and Przemyslaw Gromala, Robert Bosch GmbH

Electronic components and systems are among the main contributors to the most innovative ideas and products of today’s world. In the automotive industry, electronic components and systems are accountable for more than 80% of all innovation. When we think about highly automated and autonomous systems, advanced packaging is a must. Nowadays, most advanced electronic components such as CPUs or GPUs are being introduced into harsh environments such as automotive, avionics or space applications almost at the same time as in consumer products. Therefore, in our special session, we would like to discuss with the top experts from industry and academia what the current status and opportunities are for advanced packaging for harsh environments.

Azeem Sarwar, General Motors
Giuseppe Barone, Robert Bosch GmbH
Vikas Gupta, ASE US, Inc.
Dae-Woo Kim, Samsung
Shin-Puu Jeng, TSMC
Ram Trichur, Henkel
Kouchi Zhang, TU Delft
Vanessa Smet, Georgia Tech

Session 4: Assembly and Manufacturing Process Enhancement

Topic: Assembly and Manufacturing Technology

Wednesday May 31st 9:30 AM — 12:35 PM

2. Optimum Rc Control and Productivity Boost in Wafer-Level-Packaging Enabled by High-Throughput UBM/RDL Technology

Kay Viehweger (Fraunhofer IZM)
Carl Drechsel, Patrik Carazzetti, Carl Wang, Juergen Weichart, Ewald Strolz (alle Evatec AG)

Link: https://ectc.net/program/session4.cfm

Session 6: Co-packaged Optical Assembly

Topic: Photonics

Wednesday May 31st 9:30 AM — 12:35 PM

3. Photonic System Integration by Applying Microelectronic Packaging Approaches Using Glass Substrates

Henning Schroeder & Oliver Kirsch (Fraunhofer IZM)
Daniel Weber (Technical University Berlin)
Hendrick Thiem (TOPTICA eagleyard)

Link: https://ectc.net/program/session6.cfm

Session 37: Interactive Presentations 1
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers

Wednesday May 31st, 10:00 AM - 12:00 PM

Kai Zoschke, Charles-Alix Manier & Hermann Oppermann (Fraunhofer IZM)
Dirk Meier & Nishant Malik (Integrated Detector Electronic AS)
Elahe Zakizade & Marvin Daniel Michel (Fraunhofer IMS)
Avisek Roy, Hoang-Vu Nguyen & Hexin Xia (University of South-Eastern Norway)

Link: https://ectc.net/program/session37.cfm

Session 7: Large Formfactor Dense System Integration by FanOut

Topic: Packaging Technologies

Wednesday May 31st 2:00 PM — 5:05 PM

1. 3D Freeform Antenna-in-Package Approach for FOWLP

Tanja Braun, Tina Thomas, Karl-Friedrich Becker, Thi Huyen Le, Christian Tschoban, Rolf Aschenbrenner, Martin Schneider-Ramelow

Link: https://ectc.net/program/session7.cfm

Special Session: Plenary Session on mm-Wave Phased Array Packaging

Millimeter-Wave Phased Array Front-End Integration and Packaging for Next-Generation Communication and Radar Systems

Thursday, June 1st, 2023, 8:00 AM – 9:15 AM

Chairs: Kevin Gu, Metawave Corporation and Ivan Ndip, Fraunhofer IZM / Brandenburg University of Technology

Phased arrays are critical components in next generation communication and radar sensing systems. Current state-of-the-art and rapidly emerging research and development on millimeter-wave front-end implementations have created tremendous opportunities for innovation in packaging technologies. In this plenary panel session, we invite six leading domain experts to present their pioneering works in this area. The panel discussion will be focused on major challenges and the latest advancements in packaging and integration technologies for designing and implementing phased array front-end modules, including different substrates, interconnects, antennas, hetero-integration of silicon and III-V chips, co-design with RFICs, thermal management, system demos/prototypes, and so on.

Jonathan Hacker, Teledyne Scientific
Augusto Gutierrez-Aitken, Northrop Grumman Space Systems
Hasan Sharifi, HRL Laboratories, LLC
Madhavan Swaminathan, Pennsylvania State University
Shahriar Shahramian, Nokia Bell Labs
Alberto Valdes-Garcia, IBM Research

Session 18: Advanced Photonic Packaging and Interconnect

Topic: Photonics

Thursday June 1st 9:30 AM — 12:35 PM

4. Packaging of Ultra-Dynamic Photonic Switches and Transceivers for Integration Into 5G Radio Access Network and Datacenter Sub-systems

Geert Van Steenberge, Gunther Roelkens, Peter Ossieur, Jeroen Missinne (imec/Ghent University)
Joris Van Campenhout (imec)
Milan M. Milosevic (PHIX Photonics Assembly)
Paraskevas Bakopoulos (NVIDIA)
Igor Krestnikov (Innolume)
Stefano Stracca (Ericsson Research)
Tanja Joerg (AT&S AG)
Tanja Braun (Fraunhofer IZM)
Qixiang Cheng (Cambridge University

6. Realization, Multi-Field Coupled Simulation and Characterization of a Thermo-Mechanically Robust LiDAR Front End on a Copper Coated Glass Substrate

Marcel Kettelgerdes, Amit Pandey & Gordon Elger (Technical University of Applied Science Ingolstadt)
Peter Meszmer, Majid Tavakolibasti & Bernhard Wunderle (Chemnitz University of Technology)
Gunnar Boettger (Fraunhofer IZM)
Hueseyin Erdogan (Continental AG)

Link: https://ectc.net/program/session6.cfm

Session 21: Fine-Pitch and Intermetallic Considerations in Advanced Solder Interconnections

Topic: Interconnections

Thursday June 1st 2:00 PM — 5:05 PM

3. Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications

Gaurav Khurana (Dresden University of Technology)
Iuliana Panchenko (Fraunhofer IZM)

Link: https://ectc.net/program/session21.cfm

Session 30: Trends in Encapsulants and Low Dk/Df Dielectrics

Topic: Materials & Processing

Friday June 2nd 9:30 AM — 12:35 PM

Session Co-Chair

Tanja Braun (Fraunhofer IZM) & Kimberly Yess (Brewer Science, Inc.)

Link: https://ectc.net/program/session30.cfm

Session 31: MEMS Sensor, Bio, and Advanced Interconnect Reliability

Topic: Packaging Technologies | Applied Reliability

Friday June 2nd 2:00 PM — 5:05 PM

3. A Novel FOWLP Method to Integrate Delicate MEMS Components

Markus Woehrmann, Marc Dreissigacker, Tanja Braun, Michael Schiffer, Martin Schneider-Ramelow

Link: https://ectc.net/program/session31.cfm

Session 32: Thermo-Mechanical Modelling and Characterization

Topic: Thermal/Mechanical Simulation & Characterization

Friday June 2nd 2:00 PM — 5:05 PM

5. Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology

Saskia Gesche Huber, Andreas Stegmaier, Marius van Dijk, Nina Nguyen, Ole Hoelck, Olaf Wittler, Martin Schneider-Ramelow

Link: https://ectc.net/program/session32.cfm

Session 33: Advances in RDL, Via, and TSV Technologies for Chiplet Integration

Topic: Interconnections

Friday June 2nd 2:00 PM — 5:05 PM

1. 3D Silicon Interposer for Terabit/s Transciever Based on High-Speed TSVs

Bogdan Sirbu, Kai Zoschke & Tolga Tekin (Fraunhofer IZM)
Ukyo Suzuki & Quentin Wilmart (CEA-LETI)

Link: https://ectc.net/program/session33.cfm

Events

Conference / May 30, 2023 - June 02, 2023