Exponate

 

Exhibit by IZM-ASSID

Cu-TSV Interposer

Double sided processed 12" wafer with structures enabling electrical characterization of high frequency applications

 

Exhibit by IZM-ASSID

Glass Interposer Wafer

Test structures on a 12" wafer

 

Exhibit by IZM-ASSID

Released Multi-Layer Flexible Substrate

High Density Multi-Layer 12" Flex Substrates

 

Exhibit by IZM-ASSID

Thinned wafer

Enhanced wafer thinning and stress relief technologies for ultra-thin wafers (> 20 µm).

 

Exhibit by IZM-ASSID

Wafer Level Flip Chip Assembly

Die to Wafer (D2W) technology on 12" wafers

 

Exhibit by IZM-ASSID

3D Chip Stack

3D chip stacking (1+9) with TSV test dies

 

Exhibit by IZM-ASSID

Silicon Interposer Test Wafer with HF Structures

for Material Characterization  

 

Exhibit by IZM-ASSID

Interposer Module

SiP with ASIC and MEMS on Si TSV interposer (100 μm)

 

Exhibit by IZM-ASSID

Microfluidic Cooling

flüssigkeitsbasierten Kühlung durch die neuartige Integration von horizontalen und vertikalen Mikrofluidkanälen