Packaging technology for electronic system integration

Panel Level Packaging Consortium

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Fraunhofer IZM leads EU project on premature obsolescence

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Fraunhofer IZM is joining the EUROPRACTICE IC Service platform

Cost-effective and individualized advanced electronic packaging in small batches now available

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Get a taste of Fraunhofer IZM labs...

Fraunhofer IZM is one the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics.

For over 25 years, more than 230 institute researchers have been finding technological solutions in cooperation with partners from industry and academia. Emerging challenges are addressed in branches such as automotive and industrial electronics, medical engineering, ICT and semiconductor technology.

The advantages of working hand-in-hand with Fraunhofer IZM include:

  • Industry-compatible high-tech equipment
  • Flexible cooperation models
  • Peace-of-mind thanks to IP protection
  • International, strategic networks with universities, research institutes and private enterprise in Germany and abroad.

News

 

News | Worldwide Network

Panel Level Packaging Consortium 2.0

Exploitation is one of the overall technology interactions and limits of FOPLP. In addition, the focus is on the extension of the cost model by a fine line routing model and to other packaging architectures. This will also include a user friendly software modification.

 

News

Fraunhofer IZM leads EU project on premature obsolescence

In May 2019, the EU’s PROMPT project was launched to tackle e-waste: the aim is to establish an independent test program to evaluate the service life of consumer goods.

 

News

Fraunhofer IZM is joining the EUROPRACTICE IC Service platform

Cost-effective and individualized advanced electronic packaging in small batches now available.

 

News

Events

 

Congress | 06/23/2019 - 06/27/2019

Transducers 2019 - EUROSENSORS XXXIII

Fraunhofer IZM will be presenting current developments in sensor development and sensor integration at Tranducers 2019.

 

Messe München | 06/24/2019 - 06/27/2019

LASER World of PHOTONICS 2019

LASER World of PHOTONICS, the International Trade Fair for Photonics Components, Systems and Applications, has been held in Munich since 1973. It does a perfect job of combining technology with industrial application sectors for the widest variety of industries and uses.

 

Fair | 06/25/2019 - 06/27/2019

Sensor + Test 2019

From June 25 - June 27, 2019 the International Trade Fair SENSOR + TEST will be taking place in Nürnberg. The trade fair with the concurrent conferences is considered one of the leading events in sensorics, measuring and testing technologies in the world.

 

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

 

Publications

Fraunhofer IZM annual report & Brochure

How do IZM developments contribute to improving medical care? Which technology literally saw the light and what else went on at Fraunhofer IZM last year? All this and much more in the current annual report!