Dresden, 22.-24.01.2018 This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges in order to create Heterogeneous Integration and High Density Systems for different applications.
Piezoresistive silicon-based sensors are cost-efficient, simple to integrate, and ready for use almost everywhere. This tutorial showcases the Silicon Micro-Sensor project and the new opportunities it offers for its partners in industry.
On December 6th, Fraunhofer IZM opened its gates for Berlin’s prolific startup scene. In cooperation with CUBE GmbH, the institute hosted a very special event that allowed new entrepreneurs, investors, and many other interested visitors a chance to meet and mingle: the “Founders‘ Garage”.
On November 29, 2017 Fraunhofer IZM is hosting a Panel Level Packaging Symposium where renowned experts from global players in PLP will bring you up to date with current trends and developments. Register now to be part of this exciting event!
For his exceptional contribution to the development of Electronic Packaging and his participation in various IMAPS-committees, Klaus-Dieter Lang was honoured with the William D. Ashman Achievement Award. He was given the award on the occasion of the 50th IMAPS Microelectronics Symposium in Raleigh.
Higher processor performance with microchannel cooler
As part of the CarriCool project under the aegis of IBM, Fraunhofer researchers have developed a new, effective cooling method: By integrating microchannels into the silicon interposer it is for the first time possible to cool high-performance processors from the underside as well.