image banner PhotonicLEAP
© 2021 PhotonicLEAP

Over five million Euros for photonic packaging and test technologies#


more info

Faster, higher, stronger: Why co-packaged optics are a game changer#

REALIZM - The Fraunhofer IZM Blog

more info
banner img Applause
© Fraunhofer IZM

APPLAUSE for low-cost manufacturing of photonics, optics and electronics#

more info
Image banner EN OmniConnect
© OFFIS e.V / Fraunhofer

Radar beams for networking and localizing everyday objects#

OmniConnect project | Home networking by radar

more info
image banner Energy ECS consortium
© Spinverse

Energy ECS project develops smart and secure energy solutions for future mobility and green-energy transition#

more info
image banner CoMoDo
© PAS Deutschland GmbH

The washing machine touch display of the future: Researchers develop shape-adapted controls #

more info
© Fraunhofer IZM | Volker Mai

Fraunhofer Institute researchers win the Ralf Dahren-dorf Prize for demonstrative solutions in sustainable electronics #

more info
image banner teaser-s Tech News - Vertrauensvolle Elektronik
© Fraunhofer IZM

Trustworthy electronics#

Digital security courtesy of the BMBF

more info

Get a taste of Fraunhofer IZM labs...#

Fraunhofer IZM is one the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics. #

For over 25 years, more than 450 employees have been finding technological solutions in cooperation with partners from industry and academia. Emerging challenges are addressed in branches such as automotive and industrial electronics, medical engineering, ICT and semiconductor technology.

The advantages of working hand-in-hand with Fraunhofer IZM include:

  • Industry-compatible high-tech equipment
  • Flexible cooperation models
  • Peace-of-mind thanks to IP protection
  • International, strategic networks with universities, research institutes and private enterprise in Germany and abroad.


News | PhotonicLEAP / 19.7.2021

Over five million Euros for photonic packaging and test technologies

PhotonicLEAP, a European Horizon 2020 collaborative research project, has been awarded over €5 million Euros in funding from the European Commission to develop disruptive technologies that will drive down the cost of integrated photonic packaging and test processes.

News / 6.7.2021

APPLAUSE for low-cost manufacturing of photonics, optics and electronics

In the design and manufacture of a wide range of electronic devices, such as smartphones and self-driving vehicles, new and expanded functionalities must constantly be accommodated in the smallest possible space. Advanced packaging has emerged as an essential technology for the integration of photonics, optics and electronics.

News | OmniConnect project / 1.7.2021

Radar beams for networking and localizing everyday objects

In the OmniConnect project, Fraunhofer researchers are working with other partners on networking objects in indoor areas. They are doing this using radar beams and passive tags that are attached to moving objects, but also to people.

News / 1.7.2021

6G Research and Innovation Cluster

The German Federal Ministry of Education and Research (BMBF) has selected four hubs across Germany to conduct research on the upcoming mobile communications generation 6G. The goal is to jointly develop innovations for the telecommunications technologies of the future.

News / 29.6.2021

Energy ECS project develops smart and secure energy solutions

A new project with 30 participants from eight European countries will pave the way for an emerging new European business and technology ecosystem aimed at tackling various energy related challenges for the future of mobility. The project accelerates Europe's decarbonization goals for 2050.

News / 22.6.2021

The washing machine touch display of the future: Researchers develop shape-adapted controls

In the research project "CoMoDo" (Communication Module Inside Door), the technologies and processes needed for modern operating and display systems were researched and developed using washing machines as an example.  

News / 15.6.2021

Fraunhofer Institute researchers win the Ralf Dahren-dorf Prize

As part of the sustainablySMART project, a team of researchers at the Fraunhofer Institute for Reliability and Microintegration (IZM) have modeled the available sustainable alternatives, and how approaches from the recycling economy can be best applied to consumer goods.



Online conference | June 01 - July 04, 2021

ECTC - 2021 IEEE 71st Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology. The 71st ECTC will be held online from June 1 - 4, 2021.

Online session | August 03, 2021


In our Expert-Sessions we would like to show what is possible with glass in the field of photonic packaging and how you can still use the possibilities for your industry or for us together in joint projects. Due to the corona pandemic, we have been looking for a virtual space to get in conversation on this subject to each other.

Online workshop | November 17 - 18, 2021

Reliability of Electronic Systems

The tutorial is organized by the Institute’s Department of Environmental and Reliability Engineering, which supports new technologies on their path towards full commercial maturity. The course introduces the methods and backgrounds of application-specific reliability assurance processes in the development and production of electronic systems.

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.


Fraunhofer IZM annual report & Brochure

Like in the rest of the world, the year 2020 at Fraunhofer IZM was dominated by the COVID 19 pandemic, and this is also reflected in the current annual report. Thus, in addition to many technological highlights from the fields of automotive, industrial electronics, semiconductors and information and communication, this time there is an overview of the numerous IZM activities in corona research in the business field of medicine.

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12