Welcome - Fraunhofer IZM

High-End Performance Packaging from Wafer to System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

News

Fraunhofer IZM | 06. - 07. November 2025

Electronic Packaging Days 2025

On November 6 and 7, Fraunhofer IZM invites customers and partners from industry to the “Electronic Packaging Days” in Berlin. The event is intended to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration and to discuss them with partners.

more info

News | October 30, 2025

Soft Interfaces

Textile-integrated light switches, made possible by printable Liquid Metal Ink

A gentle tap on the knitted lampshade is enough to switch on the light. The lamp developed by Fraunhofer IZM in cooperation with WINT Design Lab works with a revolutionary conductive ink. Visitors can find out more and try the lamp themselves at the Berlin Science Week on November 1st and 2nd.

more info

News | October 29, 2025

More than a once-over – Reusable packaging for a more sustainable food industry

PFABO and its innovative deposit and returns system is taking sustainability to the next level in the food industry. Its founders, Juliane and Adrian Spieker, and their team have not only developed a new type of packaging, but invented a complete system for reusable packaging.

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News | October 01, 2025

Prof. Ivan Ndip receives the Sidney J. Stein International Award 2025

On the occasion of the 58th International Symposium on Microelectronics (IMAPS Symposium 2025) in San Diego, CA, USA, Fraunhofer IZM department head Professor Ivan Ndip was honored with the Sidney J. Stein International Award 2025.

more info

News | October 01, 2025

Glass Panel Technology Group launched under the leadership of Fraunhofer IZM

By sharing technological expertise on TGVs and RDL on glass, 15 leading companies are driving forward the development of glass-based substrates. The kick-off event for the Glass Panel Technology Group took place on October 1, 2025, at Fraunhofer IZM in Berlin.

more info

News | September 18, 2025

Interposer technology revolutionizes connections in quantum computers

Together with 24 German research institutions and companies, and under the coordination of Forschungszentrum Jülich, Fraunhofer IZM-ASSID is working on a complete German quantum computer based on superconducting quantum chips.

more info

News

Events

Exhibition | November 17 - 20, 2025

Fraunhofer IZM at COMPAMED

COMPAMED, the leading exhibition for medical technology manufacturers and developers, will again draw a crowd of technical buyers, R&D and manufacturing specialists, packaging, quality assurance, and qualification experts, and process engineers between 16 and 19 November.

more info

Exhibition | November 18 - 21, 2025

»Future Packaging« Joint Booth at productronica 2025

The “Future Packaging” line provides a live, comprehensive demonstration of aspects along the value chain of AVT processes and technologies. In addition, actual consumption is recorded in the real-world laboratory to detect the various factors that influence the carbon footprint of component manufacturing.

more info

Exhibition | November 18 - 21, 2025

Fraunhofer IZM-ASSID at Semicon West

Fraunhofer IZM-ASSID, together with Fraunhofer ENAS and IPMS as well as Leibniz IHP as part of the Research Fab Microelectronics Germany, will exhibit at this year's SEMICON Europa. With 53 exhibitors covering 528 m², the Silicon Saxony joint booth is the largest booth at the trade fair.

more info

Events

Promoting chiplet technologies

Fraunhofer IZM is an integral part of the APECS pilot line with the development of high-precision integration technologies, the prototyping of substrates and research into modular chiplet architectures.

www.apecs.eu

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

More info

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

Fraunhofer Institute for Reliability and Microintegration IZM

Soft Interfaces: Textile-integrated light switches, made possible by printable Liquid Metal Ink

Non-Stop Power for Electric Mobility

More than a once-over – Reusable packaging for a more sustainable food industry

Prof. Ivan Ndip receives the Sidney J. Stein International Award 2025

Glass Panel Technology Group launched under the leadership of Fraunhofer IZM

Interposer technology revolutionizes connections in quantum computers

Launch of the Competence Center Green ICT @ FMD

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging from Wafer to System

Departments

News

Electronic Packaging Days 2025

Soft Interfaces

More than a once-over – Reusable packaging for a more sustainable food industry

Prof. Ivan Ndip receives the Sidney J. Stein International Award 2025

Glass Panel Technology Group launched under the leadership of Fraunhofer IZM

Interposer technology revolutionizes connections in quantum computers

News

Events

Fraunhofer IZM at COMPAMED

»Future Packaging« Joint Booth at productronica 2025

Fraunhofer IZM-ASSID at Semicon West

Events

Promoting chiplet technologies

Research Fab Microelectronics Germany

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

Fraunhofer IZM annual report & Brochure

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