Fraunhofer IZM is one the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics.

For over 25 years, more than 450 employees have been finding technological solutions in cooperation with partners from industry and academia. Emerging challenges are addressed in branches such as automotive and industrial electronics, medical engineering, ICT and semiconductor technology.

The advantages of working hand-in-hand with Fraunhofer IZM include:

  • Industry-compatible high-tech equipment
  • Flexible cooperation models
  • Peace-of-mind thanks to IP protection
  • International, strategic networks with universities, research institutes and private enterprise in Germany and abroad.

News

 

News

European project on increased use of recycled plastics in electronics has started

Increasing the share of recycled plastics in new products is a central aspect of the European Strategy for Plastics, adopted by the European Commission in 2018 as a part of the first Circular Economy Action Plan (2015).

 

News

Clear advantages: Integrating metal microstructures in glass

A technique developed at Fraunhofer IZM offers a new way of integrating electrically conductive elements in glass, with the metal microstructures not deposited on the surface, but embedded and encased in the glass itself.

 

News

Adhesive-free fiber-to-chip connection by direct laser welding for integrated photonics

As part of the “PICWeld” Eurostars project, Fraunhofer IZM researchers, working with their partners LioniX International BV, Phix Photonics Assembly and ficonTEC Service GmbH, have developed an adhesive-free, space-saving and robust laser welding process for fixing optical fibers to PICs.

 

News

iNEMI Project Leadership Awards

At its annual Members Council meeting in July 2022 the International Electronics Manufacturing Initiative (iNEMI) presented its first ever "Project Leadership Awards" to five selected projects. Among the five awards, no less than three Fraunhofer IZM employees from the Environmental and Reliability Engineering (ERE) department were involved in two of the honored projects.

 

News | Award

Lars Böttcher presented with Research Award for chip embedding technologies

For over two decades, Lars Böttcher has helped electronic systems become smaller, more reliable, and better at handling high frequencies through his work on embedding chips in circuit boards.  

 

News

Recovered by
Robo Ray

The extremely nimble submersible robot uses a flexible sensor skin to detect lost and unexploded munitions in places that were formerly almost unreachable for all but the most expert divers.

 

News

Pressure sensors could make air travel easier on the environment

The BMBF is funding the second phase of the iCampµs future project with 20 million euros. The focus of the developments is on Smart Health, Environmental Sensor Technology 4.0 and Industry 4.0.

Events

 

Exhibition | September 2 - 6, 2022

Fraunhofer IZM at the IFA

Let’s meet up at our interactive exhibit at booth 336, hall 20 (IFA Next). Visitors can go on a “sustainability journey” for an easy-to-follow introduction to the technological concepts and more practical ideas for their everyday life (e.g. good practices for charging phones to keep the batteries lasting longer). The sustainability experts from our ERE unit will be on site to showcase their work for more durable electronics.

 

Symposium | September 8, 2022

4th Panel Level Consortium Symposium

Together with 17 partners from industry Fraunhofer IZM has successfully finished the second phase of the Panel Level Consortium – PLC2.0. This is the perfect time to meet again in-person for the 4th PLP Symposium!

 

Conference | September 13 - 16, 2022

Electronics System-Integration Technology Conference (ESTC)

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. 

 

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

 

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

 

Publications

Fraunhofer IZM annual report & Brochure

Researched for Practice, Developed for Reliability

 

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

 

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

 

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12