Packaging technology for electronic system integration

Fraunhofer IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.

News

News | Award

Klaus Dieter Lang receives IMAPS award

For his exceptional contribution to the development of Electronic Packaging and his participation in various IMAPS-committees, Klaus-Dieter Lang was honoured with the William D. Ashman Achievement Award. He was given the award on the occasion of the 50th IMAPS Microelectronics Symposium in Raleigh.

 

News

Higher processor performance with microchannel cooler

As part of the CarriCool project under the aegis of IBM, Fraunhofer researchers have developed a new, effective cooling method: By integrating microchannels into the silicon interposer it is for the first time possible to cool high-performance processors from the underside as well.

 

Event | 19.10.2017

Material development for next generation high performance batteries

This one-day proposal preparation workshop, to be held 19.10.2017 in the premises of Fraunhofer IZM, is aiming at forthcoming H2020 calls for cooperative projects in the field of materials development for electrified vehicle and stationary batteries, bilateral French-German calls and national funded projects.

 

Event | 29.11.2017

Public Symposium Panel Level Packaging

On November 29, 2017 Fraunhofer IZM is hosting a Panel Level Packaging Symposium where renowned experts from global players in PLP will bring you up to date with current trends and developments. Register now to be part of this exciting event!

 

Event | 6 December 2017

Founders' Garage @Halle16.Berlin

Fraunhofer IZM and CUBE invite you to join them on 6 December 2017 at the Founders' Garage @Halle16.Berlin. This is the new home of young hardware companies to test their hardware developments in an environment of high-tech equipment, research facilities, and a thriving Berlin ecosystem.

 

Highlight | Annual Report

Autonomous sensor nodes for agriculture and the energy industry

Poor silage not only endangers livestock: it can harm other uses, like the production of green energy. The better the ensilage process, the more efficiently biogas can be produced. The multi-sensor technology makes it possible for the first time to track critical parameters like the density of the silage.

 

News

Professor Martin Schneider-Ramelow appointed Deputy Director of the Institute

The veteran Head of Department of the Fraunhofer IZM is committed to reinforcing cooperation with the Technical University of Berlin and will support Professor Klaus-Dieter Lang, the Director of the Institute, in managing the IZM operations at Dresden.

 

News

A Circular Life for High-Tech Polymers

As part of the “PolyCE” project, the researchers at the Fraunhofer IZM are helping recover and reuse polymers from waste as a precious resource for new products.

 

Event | 06.07.2017

Unveiling the “Research Factory Microelectronics Germany” in Berlin and Brandenburg

On July 6th, the Ferdinand Braun Institute, the Leibniz Institute for Ultra-High Frequency Technology, opened its doors for the regional launch of the Research Factory in Berlin-Brandenburg.

 

News

A cooperation to spur innovation in technology R&D

June 28, 2017 marks the start of a new cooperation between two leading European research institutes, Leti (a research organisation of CEA Tech Grenoble) and Fraunhofer Group Microelectronics. 

 

News | Award

IZM-Researchers receive the IEEE CPMT Best Journal Paper Award

Researchers from Fraunhofer IZM , TU Berlin and TU Hamburg-Harburg have been honored with the 2016 IEEE CPMT Best Journal Paper Award in the category, “Electrical Performance of Integrated Systems”, for their paper entitled, “Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers”. 

 

News | Development

High-Pressure Sensors for Extreme Temperature

The SOI high-pressure sensors (silicon-on-insulator) developed by the Fraunhofer Institute for Reliability and Microintegration IZM makes this exact monitoring possible for processes operating at temperatures of up to 400° centigrade. 

 

Highlight | Annual Report

Master_3D

3D process technology for innovative system in package (3D-SiP) solutions - A three-dimensional stacking of chips, combined with wafer level processing, allows a functional extension and an increased complexity of electronic systems within minimum space. 

 

Highlight | Annual Report

Sustainable design decisions

Sound Life Cycle Assessments for sustainable design decisions - The comprehensive life cycle assessment of the modular Fairphone 2 was able to demonstrate the environmental effects of producing a smartphone as well as how a modular approach can lead to a reduced environmental footprint.  

 

Highlight | Annual Report

Photonic assembly

Active alignment of laser modules - The aim of the project was to develop a new type of automated assembly concept to couple a multiemitter laser-chip module to an optical fi ber with a core diameter of less than 100 µm.

 

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

Publications

Fraunhofer IZM's annual report is now available!

 

Overview

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