Welcome - Fraunhofer IZM

High-End Performance Packaging from Wafer to System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

News

News | January 20, 2026

Greater transparency for climate protection

Massive interest in a reliable way to assess the product carbon footprint for the IT industry

Net Zero by 2030: That is the ambitious goal of leading IT companies for their products’ carbon emissions, calculated across the entire semiconductor value chain.

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News | January 16, 2026

German-Indian semiconductor alliance

Shri S. Krishnan, Secretary in the Indian Ministry of Electronics and Information Technology, visited Fraunhofer IZM in Berlin. The focus was on close cooperation with the Research Fab Microelectronics Germany (FMD) and valuable exchanges with host Prof. Ulrike Ganesh, Director of Fraunhofer IZM, and Prof. Ronald Freund, Director of Fraunhofer HHI.

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News | January 15, 2026

CHASSIS

European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology

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News | December 02, 2025

Drones can detect smoldering embers in forests

As part of the EU-funded PROACTIF project, 42 European partners from research and industry are collaborating with Nokia to develop a new multi-sensor system designed specifically for drones. The German consortium, led by Fraunhofer IZM, is developing an innovative multi-sensor module that automatically detects heat.

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News | November 14, 2025

Next-generation edge AI for Europe

The PREVAIL consortium makes future technology accessible

Many innovative European companies working on edge AI technologies have, until now, been dependent on international supply chains. To reduce this dependence, research organizations from four EU countries – including Fraunhofer – are setting up a European pilot line for next-generation edge AI technologies.

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News | November 12, 2025

Catching Heart Disease Early with AI-based Sensor System

It slips on like a normal vest: Fraunhofer IZM has created a smart sensor system in cooperation with the Charité and the Technical University of Berlin. The vest records a vast array of cardiovascular parameters, which an AI-based system uses to support medical diagnostics and spot potentially dangerous developments.

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News | October 30, 2025

Soft Interfaces

Textile-integrated light switches, made possible by printable Liquid Metal Ink

A gentle tap on the knitted lampshade is enough to switch on the light. The lamp developed by Fraunhofer IZM in cooperation with WINT Design Lab works with a revolutionary conductive ink. Visitors can find out more and try the lamp themselves at the Berlin Science Week on November 1st and 2nd.

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News

Events

EXPERT SESSION SERIES | February 10 - March 10, 2026

EXPERT SESSION SERIES »Photonic Glass Core Substrates«

Strategies for Assembly, Coupling and Integrated Photonics

Glass is emerging as the substrate material of the future, also since it has ideal properties for integrating optical waveguides. Optical signal transmission helps tackle future challenges with respect to energy consumption, latency problems or heat dissipation. Fraunhofer IZM is researching industry-oriented solutions to these aspects and will present some of them in this expert session series.

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Summit | February 24 - 26, 2026

FLEX – Technology Summit

FLEX – Technology Summit is a vibrant networking event designed to foster community building. Connect with like-minded professionals, share ideas, and forge lasting relationships that will drive the industry forward.

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Exhibition | March 10 - 12, 2026

Fraunhofer IZM at the embedded world

Visit us from March 10 to 12, 2026, at embedded world in Nuremberg, Germany! At the Fraunhofer joint booth, Fraunhofer IZM will present its latest research results on sensor packaging, sensor development, and sensor networks.

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Events

Promoting chiplet technologies

Fraunhofer IZM is an integral part of the APECS pilot line with the development of high-precision integration technologies, the prototyping of substrates and research into modular chiplet architectures.

www.apecs.eu

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

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Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

Fraunhofer Institute for Reliability and Microintegration IZM

Greater transparency for climate protection

German-Indian semiconductor alliance

CHASSIS

The Science Year 2026 is dedicated to the medicine of the future.

Drones can detect smoldering embers in forests

Next-generation edge AI for Europe

Catching Heart Disease Early with AI-based Sensor System

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging from Wafer to System

Departments

News

Greater transparency for climate protection

German-Indian semiconductor alliance

CHASSIS

Drones can detect smoldering embers in forests

Next-generation edge AI for Europe

Catching Heart Disease Early with AI-based Sensor System

Soft Interfaces

News

Events

EXPERT SESSION SERIES »Photonic Glass Core Substrates«

FLEX – Technology Summit

Fraunhofer IZM at the embedded world

Events

Promoting chiplet technologies

Research Fab Microelectronics Germany

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

Fraunhofer IZM annual report & Brochure

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