Since 1993 Fraunhofer IZM has been one of the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics.

For over 30 years, more than 450 employees have been finding technological solutions in cooperation with partners from industry and academia. Emerging challenges are addressed in branches such as automotive and industrial electronics, medical engineering, ICT and semiconductor technology.

The advantages of working hand-in-hand with Fraunhofer IZM include:

  • Industry-compatible high-tech equipment
  • Flexible cooperation models
  • Peace-of-mind thanks to IP protection
  • International, strategic networks with universities, research institutes and private enterprise in Germany and abroad.

News

 

News | June 12, 2024

EV Group and Fraunhofer IZM-ASSID expand partnership in Wafer Bonding for Quantum Computing applications

ST. FLORIAN, Austria and MORITZBURG, Germany Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX)

 

News | June 11, 2024

Circular WLAN routers with sustainable aluminum bodies

WLAN routers made from aluminum, equipped with a versatile multifunctional surface, and made according to the newest EU ecodesign standards: That is the objective of a German-Polish consortium of research and industry partners.

 

News | June 6, 2024

Smart packaging for an on-board charger that is small in size, but big on performance

On-board chargers are the great equalizers for electric vehicle charging - and can be a game-changer for the future of e-mobility. Fraunhofer IZM has managed to bring together some of the most innovative ideas in power electronics to pave the way for a new generation of on-board chargers.

 

News | May 8, 2024

Rapidus and Fraunhofer IZM join Forces for High-End Performance Packaging

Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, and Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, join forces for advanced packaging solutions for 2nm node high performance computing modules.

 

News | April 29, 2024

French Ambassador François Delattre at Fraunhofer IZM

Germany and France are moving closer together. Close cooperation at the research level has already existed for years and is now being intensified, for example in the field of microelectronics for electromobility, integrated sensor technology and the protection of critical infrastructure.

 

Conference | June 18 - 20, 2024

Networking for sustainability

International conference takes up forthcoming resolutions of the European Parliament on ecodesign

Can consumers in the EU rely on electronic products meeting high environmental standards in the future? According to a regulation on the ecodesign of sustainable products, which will be voted on this Thursday in the European Parliament, this will soon no longer be a dream of the future.

 

Conference | June 12 - 14, 2024

Fraunhofer ASSID at the 3D System Summit 2024

The Fraunhofer ASSID, a branch of the Fraunhofer IZM, will exhibit at this years 3D Systems Summit 2024. The conference highlights a dynamic framework where components seamlessly collaborate to drive the next wave of technological advancements.

Events

 

Conference | June 18 - 20, 2024

Electronics Goes Green 2024+

The international EGG conference is back for its seventh outing and invites participants to get involved in the world’s leading event on greener electronics. The conference has grown into the groundbreaking platform for innovative developments on the cyclical economy, more sustainable materials, and carbon reduction in the electronics industry.

 

Exhibition | July 09 - 11, 2024

Fraunhofer IZM-ASSID and Fraunhofer IPMS at Semicon West

SEMICON West brings together the diverse global electronics supply chain to address the biggest opportunities and changes in the semiconductor ecosystem. Fraunhofer IZM-ASSID and Fraunhofer IPMS will jointly showcase their innovations at this important exhibition.

 

Conference | September 11 - 13, 2024

IEEE ESTC 2024 comes to Berlin!

The 10th IEEE Electronics System-Integration Technology Conference will be taking place in Berlin from September 11-13, 2024. IEEE ESTC is the premier international event in the field of electronics packaging and system integration, including their application in industry.

 

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

 

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

 

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

 

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

 

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

 

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12