Packaging technology for electronic system integration

Fraunhofer IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.



News | Development

High-Pressure Sensors for Extreme Temperature

The SOI high-pressure sensors (silicon-on-insulator) developed by the Fraunhofer Institute for Reliability and Microintegration IZM makes this exact monitoring possible for processes operating at temperatures of up to 400° centigrade. 


Highlight | Annual Report


3D process technology for innovative system in package (3D-SiP) solutions - A three-dimensional stacking of chips, combined with wafer level processing, allows a functional extension and an increased complexity of electronic systems within minimum space. 


Highlight | Annual Report

Sustainable design decisions

Sound Life Cycle Assessments for sustainable design decisions - The comprehensive life cycle assessment of the modular Fairphone 2 was able to demonstrate the environmental effects of producing a smartphone as well as how a modular approach can lead to a reduced environmental footprint.  


Highlight | Annual Report

Photonic assembly

Active alignment of laser modules - The aim of the project was to develop a new type of automated assembly concept to couple a multiemitter laser-chip module to an optical fi ber with a core diameter of less than 100 µm.



Smart Memphis Integration Master Class

From June 26 - 28, Malta University teams up with - amongst others - Fraunhofer IZM to present the Smart Systems Integration Master Class 2017. This three-day summer school will offer new insights on energy harvesting, energy management; ASICs and storage, packaging as well as applications.


Event Review

Fraunhofer IZM at PCIM 2017

The Fraunhofer IZM again used the opportunity to showcase its entire power electronics capabilities at this year’s PCIM in Nuremberg, the leading international expo for power electronics, intelligent drive technology, renewable energies, and power management.  


News | Award

IZM researcher honored with the Techtextil Innovation Award

After successful knee surgery, patients need to track their recovery process carefully. The MOTEX project has developed an intelligent knee sleeve to aid the patient’s recovery after complete knee transplants.  


Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.



Fraunhofer IZM's annual report is now available!



News & Events

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