Welcome - Fraunhofer IZM

High-End Performance Packaging from Wafer to System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

News

Forum | September 30 – October 1, 2026

FIRST by FMD – Fast Innovation through Research in Semiconductor Technologies

New European conference on microelectronic trends, roadmaps and strategic alignment

Join the leaders shaping Europe’s semiconductor future at FIRST by FMD, taking place 30 September – 1 October 2026 in Berlin.

FIRST is a high-level trend forum for those who turn technology into industrial leadership.

more about first

News | June 02, 2026

Scalable laser system enables optical atomic clocks for a wide range of applications

In the future, optical atomic clocks are expected to measure time 40,000 times more accurately than established atomic clocks. As part of the ISABELLA project, a consortium of industry and research partners has demonstrated key technologies for miniaturizing laser systems for this type of clocks.

more about ISABELLA

News | May 19, 2026

Gallium nitride plays a key role in greener electronics

Semiconductor technologies for energy-efficient gallium nitride electronics

A significant reduction in energy consumption and CO₂ emissions through modular and easy-to-integrate GaN power semiconductors – this is the objective of the EU-funded All2GaN project.

more about All2GaN

News | May 05, 2026

A novel inverter redefines the limits of power density

Inverters are the heart of modern electric drives. They control the energy that flows from batteries to motors, giving them massive influence over efficiency and performance. Fraunhofer IZM has achieved an evolutionary leap for this most crucial technology: An innovative inverter that handles 500 kilowatts of power in a unit just one liter in volume.

500 kilowatts per liter

News | April 28, 2026

Leveling up the electronics for e-mobility

European project develops next generation of on-board chargers

Electric cars should be better for the environment, powerful, but also affordable. However, the chargers built into them are hindering progress, as current models are reaching their limits in terms of efficiency, size, and reliability. The EU-funded HiPower 5.0 project aims to revolutionize this technology.

News | March 30, 2026

Unlocking the Circular Economy for Plastics

New EU Toolkit for Sustainable Electronics

The European research project INCREACE is setting a new milestone on the path to a truly circular economy: A consortium of universities, research institutions, and industry partners has created a comprehensive playbook and new assessment tool.

more about INCREACE

News

Events

Conference | June 17 – 19, 2026

Fraunhofer ASSID at the 3D & Systems Summit 2026

Fraunhofer IZM will be presenting technological highlights at PCIM 2026 (Power Conversion Intelligent Motion) in Nuremberg from June 9-11, 2026. The PCIM is the world's leading trade fair on the topics of power electronics, intelligent drive technology, renewable energies as well as energy management.

3D & Systems Summit

Conference | September 20 – 24, 2026

ECOC 2026 – Global Excellence in Optical Communications

From September 20 to 24, 2026, Málaga will host the European Conference on Optical Communications (ECOC), the most prestigious event for optical communications in Europe and the second largest worldwide.

ECOC 2026

Conference | October 04 – 09, 2026

Fraunhofer IZM at the European Microwave Week

EuMW is where academia meets industry. It provides access to the very latest products, research and initiatives in the microwave sector. It also offers you the opportunity for face-to-face interaction with those driving the future of microwave technology.

European Microwave Week

Events

Promoting chiplet technologies

Fraunhofer IZM is an integral part of the APECS pilot line with the development of high-precision integration technologies, the prototyping of substrates and research into modular chiplet architectures.

www.apecs.eu

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

More info

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Publications

Fraunhofer IZM annual report & Brochure

Electronic Packaging for High-Performance Systems

Fraunhofer Institute for Reliability and Microintegration IZM

AI Makes Inverse Photonic Design for Optical Sensors Faster

Scalable laser system enables optical atomic clocks for a wide range of applications

Gallium nitride plays a key role in greener electronics

A novel inverter redefines the limits of power density

FIRST by FMD – Fast Innovation through Research in Semiconductor Technologies

Leveling up the electronics for e-mobility

Unlocking the Circular Economy for Plastics

The Science Year 2026 is dedicated to the medicine of the future.

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging from Wafer to System

Departments

News

FIRST by FMD – Fast Innovation through Research in Semiconductor Technologies

Scalable laser system enables optical atomic clocks for a wide range of applications

Gallium nitride plays a key role in greener electronics

A novel inverter redefines the limits of power density

Leveling up the electronics for e-mobility

Unlocking the Circular Economy for Plastics

News

Events

Fraunhofer ASSID at the 3D & Systems Summit 2026

ECOC 2026 – Global Excellence in Optical Communications

Fraunhofer IZM at the European Microwave Week

Events

Promoting chiplet technologies

Research Fab Microelectronics Germany

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

Fraunhofer IZM annual report & Brochure

Follow us