Packaging technology for electronic system integration

Fraunhofer IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.




Fraunhofer IZM at the Measurement Fair SENSOR+TEST 2017

From May 30 - June 1, 2017 the International Trade Fair SENSOR + TEST will be taking place in Nürnberg. Fraunhofer IZM will be presenting current research findings from the areas of sensor packaging, sensor development and sensor networks at a Fraunhofer joint booth.  


News | Award

IZM researcher honored with the Techtextil Innovation Award

After successful knee surgery, patients need to track their recovery process carefully. The MOTEX project has developed an intelligent knee sleeve to aid the patient’s recovery after complete knee transplants.  



Electronic Components and Technology Conference

The ECTC is one of the leading international events in the area of packaging, components, and microelectronic systems technology. The 66th ECTC will be held in Orlando, Florida, from May 30 - June 2, 2017.



Smart Memphis Integration Master Class

From June 26 - 28, Malta University teams up with - amongst others - Fraunhofer IZM to present the Smart Systems Integration Master Class 2017. This three-day summer school will offer new insights on energy harvesting, energy management; ASICs and storage, packaging as well as applications.


Event | Tutorial

Photonic Communication, Power Delivery, Thermal Management

The tutorial demonstrates the smart implementation and robust manufacturability of advanced More-than-Moore components into a modular and scalable interposer, supporting system-on-chip and system-in-package evolution.  



SMT Hybrid Packaging 2017

From May 16 - 18, 2017 the SMT Hybrid Packaging – Europe’s leading trade fair for System Integration in Micro Electronics – takes place in Nürnberg. There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories. Have a look at the newest applications in power electronics, assembly and interconnection technologies. 



Future Packaging Production Line at SMT

“...And Hardware for all” 

2017 Topic: How can modern device manufacturing react efficiently and effectively to the ever greater variation in requirements with regard to quantities, complexity, and integration density, while offering the best possible agility?



The “Research Fab Microelectronics Germany” gets off the ground

Eleven institutes within the Fraunhofer Group for Microelectronics have, together with two institutes within the Leibniz community, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.


News | Event

More Women in Science

As part of the Fraunhofer Science Campus event from April 3rd to April 6th 2017, 80 undergraduates and postgraduates from MINT subjects will be visiting the four Fraunhofer Institutes in Berlin.


Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.



Fraunhofer IZM's annual report is now available!



News & Events

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