Packaging technology for electronic system integration

Fraunhofer IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.



Symposium | 11/27/2018 | 25th anniversary!

Fraunhofer IZM celebrates 25th anniversary!

To celebrate 25 years of excellent research, we are holding an International Symposium titled “Status & Future of Electronic Packaging” on November 27, 2018.



The new IZM annual report has arrived!

How do IZM developments contribute to improving medical care? Which technology literally saw the light and what else went on at Fraunhofer IZM last year? All this and much more in the current annual report!


Messe Nürnberg | 06/05/2018 - 06/07/2018

Future Packaging
Production Line at SMT

For the past eight years the SMT Nürnberg has set the stage for the Future Packaging live production line, organized by Fraunhofer IZM. A row of individual machines and tools, that are needed for the manufacturing of an end product. The technical focus is on intelligent automation for eMobility and robotics. Another point of discussion will be the communication between individual machines.


News | Project Medilight

Miniaturized smart system for wound therapy

Driven by the industrial partner URGO Recherche Innovation et Développement, seven partners have worked together within the H2020 EU-funded MEDILIGHT project to translate the technology behind light stimulation treatments delivered in hospitals into a smart wearable system for the personalized light treatment of chronic wounds.



Fraunhofer solves networked sensors‘ energy problems

In Fraunhofer‘s lighthouse project, the development of a extremely energy-efficient and modular hardware creates the basis for a comprehensive Internet of Things.


News | Award

Wolfram Steller wins IPWLC’s Best Paper Awards

The 2017 edition of the annual International Wafer Level Packaging Conference in San Jose, CA, has recognized the work of Dr. Wolfram Steller and his team with not one, but two Best Paper Awards.


Workshop | 06/12/2018 - 06/13/2018

Photonic Packaging: Sub-micron Assembly

The Photonics Packaging Workshop at focuses on such sub-micron automated assembly technologies for optoelectronic and photonic integration on board, package and device level.


Workshop | 06/14/2018

SMD component embedding into PCBs

The intention of the workshop is to provide a good understanding of the design rules and build-up options which are available in SMD embedding. Such embedded solutions can be realized with a reasonable budget for prototyping or small to medium-size production and are well accessible to small and medium-size companies by respectively equipped PCB manufacturers.



Crime Scene IZM

Fraunhofer IZM is in a criminal mood – as the setting for the Berlin version of Germany’s long-running crime drama series Tatort. The filming took place in early February and featured German actor Mark Waschke in his role as Detective Inspector Karow, and two members of the Institute in non-speaking parts.



Fraunhofer IZM among the Ansys Hall of Fame Finalists 2018

The IZM-researchers participated in the competition with a finite-element-based simulation method to predict the time to failure of wire bonds. This knowledge is used in the design of power electronics.


News | Dresden | Tokio

Organic Electronics – Cutting Edge Research from Saxony Goes Global

The international journey of the innovation cluster “Organic Electronics Saxony” (OES) is entering its next stage. Thirty partners from Germany and Japan have come together for two joint development projects, focusing on the development of stable OLEDs on flexible glass and printed 3D and organic electronics applications.



Fraunhofer IZM voted „Research Institute of the Year"

We are very happy about winning in the category "Research Institute of the Year" of the 3DInCites Award 2018. Thank you for your votes.




Panel Level Packaging gaining momentum

An international consortium of 17 enterprises is taking the revolution in production technology to the next level: Making the transition from fan-out wafer level packaging to fan-out panel level packaging.


Institute Director Klaus-Dieter Lang named IEEE Fellow

To mark the new year 2018, Professor Klaus-Dieter Lang (Dr. Ing. Dr. sc. techn.) has been offered the fellow grade of the Institute of Electrical and Electronics Engineers (IEEE).


Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.



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