Fraunhofer Institute for Reliability and Microintegration IZM

Fraunhofer Institute for Reliability and Microintegration IZM

E-MERGENCE:

How electronics in fashion can reduce stress and support epilepsy patients

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© Micha Omni and Fraunhofer IZM

Smartphone, front and back side
© Fraunhofer IZM | Tapani Jokinen & Robin Hoske

Reimagining smartphones

Modular mobile devices against the flood of electronic waste

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© Fraunhofer IZM | Tapani Jokinen & Robin Hoske

patch with sensors
© Fraunhofer IZM | Volker Mai

ECG with a patch

APPLAUSE European collaborative project successfully completed

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© Fraunhofer IZM | Volker Mai

banner - Glasinterposer
© Fraunhofer IZM | Volker Mai

Ideas for Green Electronics Manufacturing at the 10th MikroSystemTechnik Congress in Dresden

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© Fraunhofer IZM | Volker Mai

banner/teaser 30 Y Fraunhofer IZM
© Fraunhofer IZM

Packaging, connecting, and integrating

30 years of Fraunhofer IZM - 30 years of packaging and interconnection excellence in microelectronics

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© Fraunhofer IZM

© worradirek / adobe.stock.com

Maintenance for Industry 4.0

How Multi-Sensor Technology, AI, and Data Fusion Advance Machine Maintenance

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© worradirek / adobe.stock.com

Von der Schule ins Labor – Fraunhofer IZM verlängert Kooperation mit MINT-freundlichem Gymnasium
© Fraunhofer IZM

Out of the school and into the lab

Fraunhofer IZM extends cooperation with STEM-friendly high school

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© Fraunhofer IZM

On the junction of the circuit board for the computer, a tree with soil is sprouting. Background of wireframe network and blue light. Concepts for CSR, green technology, green. Generative AI
© Emily / stock.adobe.com

Using magnetic effects in electrons for a hundredfold reduction in the power consumption of future chips

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© Emily / stock.adobe.com

banner image - crossing frontiers in microelectronics

Get a taste of Fraunhofer IZM labs...

Since 1993 Fraunhofer IZM has been one of the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics.

For over 30 years, more than 450 employees have been finding technological solutions in cooperation with partners from industry and academia. Emerging challenges are addressed in branches such as automotive and industrial electronics, medical engineering, ICT and semiconductor technology.

The advantages of working hand-in-hand with Fraunhofer IZM include:

  • Industry-compatible high-tech equipment
  • Flexible cooperation models
  • Peace-of-mind thanks to IP protection
  • International, strategic networks with universities, research institutes and private enterprise in Germany and abroad.

Departments

Fraunhofer IZM

Wafer Level System Integration
System Integration & Interconnection Technologies
Environmental & Reliability Engineering
RF & Smart Sensor Systems

News

 

© Fraunhofer IZM | Tapani Jokinen & Robin Hoske

News / 24.10.2023

Reimagining smartphones

How can the production and use of smartphones be brought back into a healthier balance with our environment? This is the question that two industrial designers wanted to answer at Fraunhofer IZM as part of the BMBF-funded MoDeSt project, researching whether modern technology and a circular economy can go together.

more info
 

© Fraunhofer IZM | Volker Mai

News / 10.10.2023

ECG with a patch: APPLAUSE successfully completed

Researchers from Fraunhofer IZM, together with 31 partners from industry and research, have developed a stretchable and wireless patch that can be used to make it possible to conduct diagnostically relevant cardiac monitoring in everyday life.

more info
 

© Fraunhofer IZM | Volker Mai

News / 6.10.2023

Ideas for Green Electronics Manufacturing

The largest German-speaking congress in the field of electronics and microsystems will be held in Dresden from October 23 - 25, 2023. On the occasion of the tenth anniversary, sustainability and technology sovereignty in particular will be presented in exhibits and conference contributions.

more info
 

© Fraunhofer IZM

News / 5.10.2023

Pioneering work for the microelectronics of tomorrow

From Chiplet Integration to Cooling - Challenges in High-End Performance Packaging

mehr info
 

© Fraunhofer IZM

News / 20.10.2023

Packaging, connecting, and integrating

Packaging, connecting, and integrating: 30 years of Fraunhofer IZM - 30 years of packaging and interconnection excellence in microelectronics

more info
 

© Fraunhofer IZM

News / 12.9.2023

Out of the school and into the lab

With various elective courses, individual career events and more, Fraunhofer IZM and the Gabriele-von-Bülow-Gymnasium want to intensify the already close cooperation between school and research institute even more.

more info
 

© Emily / stock.adobe.com

News / 15.8.2023

Reduction in the power consumption of future chips

A new EU-funded project has brought together a high-profile consortium from science and industry to investigate how changes to the magnetic properties of semiconductors could achieve a hundredfold reduction in the power consumption of computer chips.

more info
 

News

Events

 

© Fraunhofer IZM

Online Session | December 05, 2023

Session series »Materials for electronic innovations«

#4th session of our series // Speakers: RONJA SCHOLZ & THERESA AIGNER // In electronical and electric products plastics need to fulfill specific technical requirements which makes them difficult to recycle and replace by recyclates. This expert session will demonstrate how OEMs from different EEE sectors overcome these challenges and introduce design guidelines for and from recycling.

more info
 

Conference | May 15 - 16, 2024

ICCC2024 - iCampus Cottbus Conference

The iCampus Cottbus Conference, which will take place from May 15-16, 2024, is dedicated to the role of sensor technology, MEMS & AI as key factors in structural change. The aim of the conference is to present current trends and research results in the field of microsensors for industrial applications and give the scientific community a chance to network.

more info
 

© Fraunhofer IZM | Volker Mai

Conference | June 18 - 20, 2024

Electronics Goes Green 2024+

The international EGG conference is back for its seventh outing and invites participants to get involved in the world’s leading event on greener electronics. The conference has grown into the groundbreaking platform for innovative developments on the cyclical economy, more sustainable materials, and carbon reduction in the electronics industry.

more info
 

Events

 

© Leistungszentrum Digitale Vernetzung

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

 

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

 

© Fraunhofer IZM | Volker Mai

Publications

Fraunhofer IZM annual report & Brochure

Researched for Practice, Developed for Reliability

 

© Kai Abresch photography

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

 

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

 

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

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