Welcome - Fraunhofer IZM

High-End Performance Packaging from Wafer to System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

News

News | November 3, 2026

3D detector for neutrino research

Deep-structured microchips distinguish particles by their angle of incidence

Researchers at Fraunhofer IZM and the University of Münster have developed a wafer-based manufacturing process for a novel silicon diode that can measure particles depending on their angle of incidence.

KATRIN-Experiment

News | October 14, 2026

Ultrathin Chip Foil Packages for Flexible Electronics

Flexible electronics enable more comfortable sensor patches, smarter packaging, and adaptable human-machine interfaces. In the CFP project, chip foil packages less than 150 micrometers thick are being developed to reliably protect electronic functions and enable resource-efficient production in high volumes.

Chip Foil Packages

Event Review | October 7, 2026

Sold-out debut: FIRST by FMD Strikes a Chord with the Microelectron-ics Industry

More than 500 participants from over 200 companies, including ASML, Bosch, Intel, Infineon, GlobalFoundries, and TRUMPF, gathered in Berlin on September 30 and October 1, 2026, for the inaugural edition of FIRST by FMD.

FIRST by FMD

News | October 5, 2026

WIKA commercializes Fraunhofer IZM overhead line monitoring technology

A major success for technology transfer from applied research: At the end of July 2026, Fraunhofer IZM, Fraunhofer ENAS, and WIKA Alexander Wiegand SE & Co. KG signed a comprehensive agreement to commercialize the ASTROSE^® overhead line monitoring technology.

ASTROSE®

News | September 28, 2026

Fraunhofer IZM strengthens research bridge with Japan

The Fraunhofer IZM, the Fraunhofer EMFT, Kumamoto University, and Yamagata University are pooling their expertise. The four institutions signed a memorandum of understanding in Kumamoto to promote international cooperation in research, education, and workforce development.

German-Japanese alliance

News | September 15, 2026

Integrated radar sensors enable safe and flexible environment sensing

Radar technology for local and distributed signal processing

Automated Guided Vehicles that can sense and process their environment in
all three dimensions: That is the result of a collaborative project funded by the Federal Ministry for Research, Technology, and Space.

Project PLATON

News | September 01, 2026

Improving the quality of life of patients with Parkinson’s Disease with flexible brain implants

Brain-computer interfaces for neurotherapy
Working with partners from across Europe, Fraunhofer IZM has helped create highly integrated and flexible brain implants as a new, minimally invasive method for treating neurological disorders like Parkinson’s Disease.

Minigraph

News

Events

Online Expert Session Series | Oct 13 – Nov 10, 2026

New Online Sessions about Green ICT Developments

This series explores the environmental impact of electronics and digitalisation, from AI data centers to sustainable design and carbon reporting. Fraunhofer IZM experts share insights and practical approaches for more resource-efficient, future-ready electronics.

Green ICT

Exhibition | November 10 – 13, 2026

electronica 2026

The electronica, the world's leading trade fair and conference for electronics, will take place from November 10-13, 2026 at the Trade Fair Center of Messe München. The trade fair offers a broad spectrum of exhibits from the world of electronics, ranging from automotives to electromechanics, electronics design, printed circuit boards, micro and nano systems and sensor technology, among others.

electronica

Conference & Exhibition | November 10 – 13, 2026

Fraunhofer IZM-ASSID at SEMICON Europa

Fraunhofer IZM-ASSID, together with Fraunhofer ENAS and IPMS as part of the Research Fab Microelectronics Germany, will exhibit at this year's SEMICON Europa. With 33 exhibitors covering 288 m², the Silicon Saxony joint booth is the largest booth at the trade fair.

SEMICON Europa

Events

Departments

Wafer Level System Integration

Head: Dr. Michael Schiffer, Dr. Manuela Junghähnel

more info

System Integration & Interconnection Technologies

Head: Dr. Tanja Braun, Dr. Andreas Ostmann

more info

Environmental & Reliability Engineering

Head: Dr. Nils F. Nissen

more info

RF & Smart Sensor Systems

Head: Dr.-Ing. Prof. Dr.-Ing. habil. Ivan Ndip,
Harald Pötter

more info

Promoting chiplet technologies

Fraunhofer IZM is an integral part of the APECS pilot line with the development of high-precision integration technologies, the prototyping of substrates and research into modular chiplet architectures.

APECS-Pilot line

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

More info

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Publications

Fraunhofer IZM annual report & Brochure

Electronic Packaging for High-Performance Systems

Fraunhofer Institute for Reliability and Microintegration IZM

Who Decides Whether an Electronic Device is Recyclable?

Deep-structured microchips distinguish particles by their angle of incidence

Ultrathin Chip Foil Packages for Flexible Electronics

WIKA commercializes Fraunhofer IZM overhead line monitoring technology

Fraunhofer IZM strengthens research bridge with Japan

Integrated radar sensors enable safe and flexible environment sensing

Improving the quality of life of patients with Parkinson’s Disease with flexible brain implants

From Lab into the Air: Palm-Sized Glass Bench Makes Atom Gravimeters Mobile

The Science Year 2026 is dedicated to the medicine of the future.

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging from Wafer to System

News

3D detector for neutrino research

Ultrathin Chip Foil Packages for Flexible Electronics

Sold-out debut: FIRST by FMD Strikes a Chord with the Microelectron-ics Industry

WIKA commercializes Fraunhofer IZM overhead line monitoring technology

Fraunhofer IZM strengthens research bridge with Japan

Integrated radar sensors enable safe and flexible environment sensing

Improving the quality of life of patients with Parkinson’s Disease with flexible brain implants

News

Events

New Online Sessions about Green ICT Developments

electronica 2026

Fraunhofer IZM-ASSID at SEMICON Europa

Events

Departments

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

Promoting chiplet technologies

Research Fab Microelectronics Germany

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

Fraunhofer IZM annual report & Brochure

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