Fraunhofer IZM is one the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics.

For over 25 years, more than 450 employees have been finding technological solutions in cooperation with partners from industry and academia. Emerging challenges are addressed in branches such as automotive and industrial electronics, medical engineering, ICT and semiconductor technology.

The advantages of working hand-in-hand with Fraunhofer IZM include:

  • Industry-compatible high-tech equipment
  • Flexible cooperation models
  • Peace-of-mind thanks to IP protection
  • International, strategic networks with universities, research institutes and private enterprise in Germany and abroad.



News / 27.9.2022

Let’s Meet Dr. Manuela Junghähnel

Two years ago, our Institute’s site in Moritzburg – the »All Silicon System Integration Dresden – ASSID« - was able to celebrate a decade of successful work. This year saw a change at the helm, with Dr. Manuela Junghähnel (MJ) taking over at the top. We are excited to have her with us!



Split manufacturing for trustworthy electronics "Made in Germany"

A consortium of Fraunhofer institutes and well-known German industrial companies is developing a split-manufacturing approach for semiconductor production in the project "Distributed Manufacturing for Novel and Trustworthy Electronics T4T".  



EU regulations set to make smartphones and tablets more sustainable

The European Commission is determined to make smartphones and tablets easier on our environment. Two draft sets of regulations are introducing a comprehensive ecodesign catalogue as part of the EU’s circular economy action plan.



Hollow-core fibers for precise positioning in space

The vision of cars that drive or planes that fly themselves can only become true if the electronics on board can determine where they are in space, anytime and with reliable precision. In the aerospace sector, this job is given over to optical gyroscopes that measure light to check and stabilize the course of a vessel in flight.



European project on increased use of recycled plastics in electronics has started

Increasing the share of recycled plastics in new products is a central aspect of the European Strategy for Plastics, adopted by the European Commission in 2018 as a part of the first Circular Economy Action Plan (2015).



Clear advantages: Integrating metal microstructures in glass

A technique developed at Fraunhofer IZM offers a new way of integrating electrically conductive elements in glass, with the metal microstructures not deposited on the surface, but embedded and encased in the glass itself.



Adhesive-free fiber-to-chip connection by direct laser welding for integrated photonics

As part of the “PICWeld” Eurostars project, Fraunhofer IZM researchers, working with their partners LioniX International BV, Phix Photonics Assembly and ficonTEC Service GmbH, have developed an adhesive-free, space-saving and robust laser welding process for fixing optical fibers to PICs.



Conference | September 13 - 16, 2022

Electronics System-Integration Technology Conference (ESTC)

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. 


Symposium | September 26 - 29, 2022

ESREF 2022

33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis. This international symposium continues to focus on recent developments and future perspectives in Quality and Reliability Management of materials, devices and circuits for micro-, nano-, and optoelectronics.


Online Session | October 13, 2022

IZM Photonics: In optical interconnects we trust

In our expert sessions, we want to show what is possible today in the field of photonic packaging using microelectronic packaging experience on wafer and board level and how you can seize this potential for your industry or for joint projects with us.  


Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.


High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz


Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.



Fraunhofer IZM annual report & Brochure

Researched for Practice, Developed for Reliability


Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11


Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11


Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12