Packaging technology for electronic system integration

Fraunhofer IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.

News

 

Fraunhofer IZM celebrates 25th anniversary!

Milestones in microsystem technology – since 1993 Fraunhofer IZM has been setting new trends in microelectronic packaging.

 

News

Panel Level Packaging gaining momentum

An international consortium of 17 enterprises is taking the revolution in production technology to the next level: Making the transition from fan-out wafer level packaging to fan-out panel level packaging.

 

Lab Course | 03/14/2018 - 03/16/2018

Bare-Die Processing and Assembly in Flip-Chip and Die-Attach Technologies

The lab course is hosted in partnership by Bond-IQ, Finetech GmbH and Fraunhofer IZM Berlin.

 

Tutorial | 03/20/2018

Customized Silicon-Based 
Sensors

Piezoresistive silicon-based sensors are cost-efficient, 
simple to integrate, and ready for use almost everywhere. This tutorial showcases the Silicon Micro-Sensor project and the new opportunities it offers for its partners in industry.

 

Institute Director Klaus-Dieter Lang named IEEE Fellow

To mark the new year 2018, Professor Klaus-Dieter Lang (Dr. Ing. Dr. sc. techn.) has been offered the fellow grade of the Institute of Electrical and Electronics Engineers (IEEE).

 

Workshop | 03/15/2018

Reliability is no accident! Design, Material, Technology, Simulation, Test

Modern electronic packaging combines a vast range of components with diverse means for system integration. The reliability of modern mixed microsystems – will be the focus of this event.

 

Event Review

Pitching for Fraunhofer Knowhow

On December 6th, Fraunhofer IZM opened its gates for Berlin’s prolific startup scene. In cooperation with CUBE GmbH, the institute hosted a very special event that allowed new entrepreneurs, investors, and many other interested visitors a chance to meet and mingle: the “Founders‘ Garage”.

 

Hardware-Hub | 6 December 2017

Hardware Startups: Getting Connected and Pitching Business Ideas at Fraunhofer IZM

The Founders‘ Garage calls all startups to the new hardware hub. Where? @Halle16.Berlin at Fraunhofer IZM. When? December 6th

All hardware startups interested in taking part in the pitches can apply until December 4th.

 

Event | 29.11.2017

Public Symposium Panel Level Packaging

On November 29, 2017 Fraunhofer IZM is hosting a Panel Level Packaging Symposium where renowned experts from global players in PLP will bring you up to date with current trends and developments. Register now to be part of this exciting event!

 

News

Higher processor performance with microchannel cooler

As part of the CarriCool project under the aegis of IBM, Fraunhofer researchers have developed a new, effective cooling method: By integrating microchannels into the silicon interposer it is for the first time possible to cool high-performance processors from the underside as well.

 

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

Publications

Fraunhofer IZM's annual report is now available!

 

Overview

News & Events

Get a taste of Fraunhofer IZM labs...