Panel Packaging Consortium

2 years of success: 60 members from the Panel Packaging Consortium discussed the results at Fraunhofer IZM in Berlin.

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Packaging technology for electronic system integration

Dr. Henning Schröder receives Fraunhofer IZM Research Award 2018

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Gauss and Gaiety: 25 Years of Fraunhofer IZM

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Get a taste of Fraunhofer IZM labs...

Fraunhofer IZM is one the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics.

For over 25 years, more than 230 institute researchers have been finding technological solutions in cooperation with partners from industry and academia. Emerging challenges are addressed in branches such as automotive and industrial electronics, medical engineering, ICT and semiconductor technology.

The advantages of working hand-in-hand with Fraunhofer IZM include:

  • Industry-compatible high-tech equipment
  • Flexible cooperation models
  • Peace-of-mind thanks to IP protection
  • International, strategic networks with universities, research institutes and private enterprise in Germany and abroad.



Symposium | Trainings and Workshops

Panel Level Packaging in Dresden und Berlin

Almost 100 participants came together for the fourth Symposium on »Status & Trends in Panel Level Packaging« at the Hilton Hotel in Dresden on Jan. 30, 2019. The meeting was a post event of the 3D & Systems Summit.


News | Review

Gauss and Gaiety: 25 Years of Fraunhofer IZM

On 27 November, Fraunhofer IZM celebrated its 25th anniversary. High profile speakers from science and industry used the opportunity to look back at a quarter of a century of progress and to look ahead at the future of microelectronics and electronic packaging.


News | Award

Dr. Henning Schröder receives the Fraunhofer IZM Research Award 2018

The physicist adapted integrated optics processes for use with thin glass. The result of his efforts: Thin glass with optical capabilities.





Workshop | 02/26/2019 - 02/27/2019

Wide-Bandgap User Training

Wide-bandgap-semiconductors (WBG) are the next generation of power electronics. This tutorial was initially prepared in the framework of the CLINT-WPE project to convey practical know-how to engineers working with SiC and GaN devices.


Exhibition | 02/26/2019 - 02/28/2019

Fraunhofer IZM at the embedded world 2019

From February 26 – 28, 2019 Fraunhofer IZM will be presenting current trends in sensor integration at the embedded world industrial fair in Nürnberg.

We look forward to welcoming you at the joint Fraunhofer booth 4-470!!


Training | 03/04/2019 - 03/05/2019

Learning Factory

The Ecodesign Learning Factory is a training open for professionals and teachers which aims to convey methods and tools to enable participants to design products and services for a circular economy.


Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.


Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.



Fraunhofer IZM annual report & Brochure

How do IZM developments contribute to improving medical care? Which technology literally saw the light and what else went on at Fraunhofer IZM last year? All this and much more in the current annual report!