Packaging technology for electronic system integration

Fraunhofer IZM helps companies assemble robust and reliable electronic systems and integrate these into the application environment.



Symposium | 11/27/2018 | 25th anniversary!

Fraunhofer IZM celebrates 25th anniversary!

To celebrate 25 years of excellent research, we are holding an International Symposium titled “Status & Future of Electronic Packaging” on November 27, 2018.



A new founded group at Fraunhofer IZM is developing bioelectronics medicine

The group “Technologies for Bioelectronic Medicine” was founded in July 2018. The aim is to develop a platform technology for electroceuticals. These are intelligent, customizable micro-implants that can target certain regions of the nervous system. 



IHK Research Transfer Award for Flexible Circuit Boards

Dr. Thomas Löher and his team have been awarded the IHK Research Transfer Award for their design of an elastic circuit board.



Science Journalists welcomed at Fraunhofer IZM

The Berlin Center for Digital Transformation is the shared home of Berlin’s Fraunhofer Institutes for a plethora of research and development activities, ranging from information and communications technology, data processing, the realization of novel electronic systems to production technology and microelectronics.


Workshop | 10/17/2018

Wafer Level Packaging & Sensor Integration

Wafer level packaging is a synonym for the whole technology spectrum enabling direct chip attachment on PWB or other substrates by flip chip interconnection. In contrast to pure bumping processes additional thin film wiring layers are required featuring a higher level of integration by embedding active or passive devices onto the chip. The technology is feasible for any kind of CMOS wafers but also for III/V or even sensors.


News | Project Medilight

Miniaturized smart system for wound therapy

Driven by the industrial partner URGO Recherche Innovation et Développement, seven partners have worked together within the H2020 EU-funded MEDILIGHT project to translate the technology behind light stimulation treatments delivered in hospitals into a smart wearable system for the personalized light treatment of chronic wounds.



Fraunhofer IZM among the Ansys Hall of Fame Finalists 2018

The IZM-researchers participated in the competition with a finite-element-based simulation method to predict the time to failure of wire bonds. This knowledge is used in the design of power electronics.



Fraunhofer solves networked sensors‘ energy problems

In Fraunhofer‘s lighthouse project, the development of a extremely energy-efficient and modular hardware creates the basis for a comprehensive Internet of Things.



ISO-certified quality management system

Fraunhofer IZM has achieved another important milestone in its commitment to qualified customer-specific process development: The International Certification Group (ICG) confirms that the quality management system of the "Wafer Level System Integration" (WLSI) department is in accordance with the standard DIN EN ISO 9001:2015 and has been officially certified for “Research, development, and services in electronic packaging”.



The new IZM annual report has arrived!

How do IZM developments contribute to improving medical care? Which technology literally saw the light and what else went on at Fraunhofer IZM last year? All this and much more in the current annual report!


Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.



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