Welcome - Fraunhofer IZM

High-End Performance Packaging from Wafer to System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

News

Forum | September 30 – October 1, 2026

FIRST by FMD – Fast Innovation through Research in Semiconductor Technologies

New European conference on microelectronic trends, roadmaps and strategic alignment

Join the leaders shaping Europe’s semiconductor future at FIRST by FMD, taking place 30 September – 1 October 2026 in Berlin.

FIRST is a high-level trend forum for those who turn technology into industrial leadership.

more about first

News | July 10, 2026

Future technologies are increasing raw material demand:

A Fraunhofer study shows where action is needed

How will emerging technologies such as electric mobility, renewable energy and artificial intelligence impact raw material demand? This question is addressed in the new edition of the “Raw Materials for Future Technologies” study which was presented today.

News | June 30, 2026

Interactive exhibition turns neuronal communication into a physical experience

Experiencing bioelectronics as an intersection between science, art, and design

A new way to experience bioelectronics created by the union of applied research and media art.

Somatic Circuits

News | June 24, 2026

Laser amplifier enables scalable quantum computers and completes European technology chain

Compact and stable laser amplifiers are essential to clear the path towards powerful quantum computing.

more about QAmp

News | June 02, 2026

Scalable laser system enables optical atomic clocks for a wide range of applications

In the future, optical atomic clocks are expected to measure time 40,000 times more accurately than established atomic clocks. As part of the ISABELLA project, a consortium of industry and research partners has demonstrated key technologies for miniaturizing laser systems for this type of clocks.

more about ISABELLA

News | May 19, 2026

Gallium nitride plays a key role in greener electronics

Semiconductor technologies for energy-efficient gallium nitride electronics

A significant reduction in energy consumption and CO₂ emissions through modular and easy-to-integrate GaN power semiconductors – this is the objective of the EU-funded All2GaN project.

more about All2GaN

News

Events

Conference | September 20 – 24, 2026

ECOC 2026 – Global Excellence in Optical Communications

From September 20 to 24, 2026, Málaga will host the European Conference on Optical Communications (ECOC), the most prestigious event for optical communications in Europe and the second largest worldwide.

ECOC 2026

Conference | October 04 – 09, 2026

Fraunhofer IZM at the European Microwave Week

EuMW is where academia meets industry. It provides access to the very latest products, research and initiatives in the microwave sector. It also offers you the opportunity for face-to-face interaction with those driving the future of microwave technology.

European Microwave Week

Exhibition | October 06 – 08, 2026

EFX – Expo for Electronics Manufacturing

Three intensive days at EFX in Stuttgart offer valuable insights into modern and future electronics manufacturing. Topics include smart manufacturing, artificial intelligence, data analysis, advanced packaging and miniaturization, supply chain resilience, prototype development, automated manufacturing processes, and regional production capacities.

EFX 2026

Events

Promoting chiplet technologies

Fraunhofer IZM is an integral part of the APECS pilot line with the development of high-precision integration technologies, the prototyping of substrates and research into modular chiplet architectures.

www.apecs.eu

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

More info

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Publications

Fraunhofer IZM annual report & Brochure

Electronic Packaging for High-Performance Systems

Fraunhofer Institute for Reliability and Microintegration IZM

Future technologies are increasing raw material demand

From Prism to Glass Interposer

Interactive exhibition turns neuronal communication into a physical experience

Drones can detect smoldering embers in forests

Laser amplifier enables scalable quantum computers and completes the European technology chain

Scalable laser system enables optical atomic clocks for a wide range of applications

Gallium nitride plays a key role in greener electronics

FIRST by FMD – Fast Innovation through Research in Semiconductor Technologies

The Science Year 2026 is dedicated to the medicine of the future.

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging from Wafer to System

Departments

News

FIRST by FMD – Fast Innovation through Research in Semiconductor Technologies

Future technologies are increasing raw material demand:

Interactive exhibition turns neuronal communication into a physical experience

Laser amplifier enables scalable quantum computers and completes European technology chain

Scalable laser system enables optical atomic clocks for a wide range of applications

Gallium nitride plays a key role in greener electronics

News

Events

ECOC 2026 – Global Excellence in Optical Communications

Fraunhofer IZM at the European Microwave Week

EFX – Expo for Electronics Manufacturing

Events

Promoting chiplet technologies

Research Fab Microelectronics Germany

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

Fraunhofer IZM annual report & Brochure

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