Packaging technology for electronic system integration

Fraunhofer IZM is one the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics.

For over 25 years, more than 230 institute researchers have been finding technological solutions in cooperation with partners from industry and academia. Emerging challenges are addressed in branches such as automotive and industrial electronics, medical engineering, ICT and semiconductor technology.

The advantages of working hand-in-hand with Fraunhofer IZM include:

  • Industry-compatible high-tech equipment
  • Flexible cooperation models
  • Peace-of-mind thanks to IP protection
  • International, strategic networks with universities, research institutes and private enterprise in Germany and abroad.




A new founded group at Fraunhofer IZM is developing bioelectronics medicine

The new group “Technologies for Bioelectronic Medicine” will start its activities in September 2018. The aim is to develop a platform technology for electroceuticals. These are intelligent, customizable micro-implants that can target certain regions of the nervous system. 



IHK Research Transfer Award for Flexible Circuit Boards

Dr. Thomas Löher and his team have been awarded the IHK Research Transfer Award for their design of an elastic circuit board.



Science Journalists welcomed at Fraunhofer IZM

The Berlin Center for Digital Transformation is the shared home of Berlin’s Fraunhofer Institutes for a plethora of research and development activities, ranging from information and communications technology, data processing, the realization of novel electronic systems to production technology and microelectronics.



Symposium | 11/27/2018 | 25th anniversary!

Fraunhofer IZM celebrates 25th anniversary!

To celebrate 25 years of excellent research, we are holding an International Symposium titled “Status & Future of Electronic Packaging” on November 27, 2018.


Conference | Exhibition | 09/18/2018 - 09/21/2018

Electronics System Integration Technology Conference

ESTC in Dresden

Over the last 12 years the Electronics System Integration Technology Conference ESTC has established itself as one of Europe’s most important packaging events.  


Symposium | 09/26/2018

6th Optical Interconnect in Data Centers Symposium

The symposium is focused on high-performance, low-energy and cost and small-size optical interconnects across the different hierarchy levels in data center.


Workshop | 10/17/2018

Wafer Level Packaging & Sensor Integration

Wafer level packaging is a synonym for the whole technology spectrum enabling direct chip attachment on PWB or other substrates by flip chip interconnection.


Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

Get a taste of Fraunhofer IZM labs...