Packaging technology for electronic system integration

Christoph Marczok receives the Young Engineer Award

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Miniature transponder helps localize tools

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Globalfoundries, Fraunhofer and Next Big Thing found start-up

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Get a taste of Fraunhofer IZM labs...

Fraunhofer IZM is one the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics.

For over 25 years, more than 230 institute researchers have been finding technological solutions in cooperation with partners from industry and academia. Emerging challenges are addressed in branches such as automotive and industrial electronics, medical engineering, ICT and semiconductor technology.

The advantages of working hand-in-hand with Fraunhofer IZM include:

  • Industry-compatible high-tech equipment
  • Flexible cooperation models
  • Peace-of-mind thanks to IP protection
  • International, strategic networks with universities, research institutes and private enterprise in Germany and abroad.

News

 

News

Christoph Marczok receives the Young Engineer Award

Christoph Marczok’s paper on the subject of „Low Inductive SiC Mold Module with Direct Cooling“ is honoured with the Young Engineer Award of the PCIM Europe 2019.

 

News

Miniature transponder helps localize tools

What really happens on the assembly line? High-precision localization promises more transparency!  

A miniature transponder helps localize tools at manual assembly stations. Fraunhofer IZM has developed a specialized transponder in the joint NaLoSysPro project to track and record safety-critical assembly tasks in industry with precise location data.  

 

News

Globalfoundries, Fraunhofer and Next Big Thing found start-up

Sensry enables small and medium-sized businesses to gain access to innovative semiconductor technologies 

 

News

Events

 

Trade fair | 05/07/2019 - 05/09/2019

PCIM Europe 2019

Fraunhofer IZM will be presenting its entire range of services from in the realm of power electronics at PCIM 2019 – covering everything from system design and packaging technologies for power electronics up to reliability aspects and cooling concepts.

 

Trade fair | 05/07/2019 - 05/09/2019

SMT Hybrid Packaging becomes SMTconnect

We cordially invite you to visit Fraunhofer IZM in Hall 4! There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories.

 

Trade fair | 05/07/2019 - 05/09/2019

Future Packaging Production Line at SMTconnect 2019

"Get In The Ring" - Facing up to the challenges of future manufacturing. For the past nine years the SMTconnect in Nuremberg has set the stage for the Future Packaging live production line, organized by Fraunhofer IZM. A row of individual machines and tools, that are needed for the manufacturing of an end product.  

 

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

 

Publications

Fraunhofer IZM annual report & Brochure

How do IZM developments contribute to improving medical care? Which technology literally saw the light and what else went on at Fraunhofer IZM last year? All this and much more in the current annual report!