A new founded group at Fraunhofer IZM is developing bioelectronics medicine
The group “Technologies for Bioelectronic Medicine” was founded in July 2018. The aim is to develop a platform technology for electroceuticals. These are intelligent, customizable micro-implants that can target certain regions of the nervous system.
The Berlin Center for Digital Transformation is the shared home of Berlin’s Fraunhofer Institutes for a plethora of research and development activities, ranging from information and communications technology, data processing, the realization of novel electronic systems to production technology and microelectronics.
Wafer level packaging is a synonym for the whole technology spectrum enabling direct chip attachment on PWB or other substrates by flip chip interconnection. In contrast to pure bumping processes additional thin film wiring layers are required featuring a higher level of integration by embedding active or passive devices onto the chip. The technology is feasible for any kind of CMOS wafers but also for III/V or even sensors.
Driven by the industrial partner URGO Recherche Innovation et Développement, seven partners have worked together within the H2020 EU-funded MEDILIGHT project to translate the technology behind light stimulation treatments delivered in hospitals into a smart wearable system for the personalized light treatment of chronic wounds.
Fraunhofer IZM among the Ansys Hall of Fame Finalists 2018
The IZM-researchers participated in the competition with a finite-element-based simulation method to predict the time to failure of wire bonds. This knowledge is used in the design of power electronics.
Fraunhofer IZM has achieved another important milestone in its commitment to qualified customer-specific process development: The International Certification Group (ICG) confirms that the quality management system of the "Wafer Level System Integration" (WLSI) department is in accordance with the standard DIN EN ISO 9001:2015 and has been officially certified for “Research, development, and services in electronic packaging”.
How do IZM developments contribute to improving medical care? Which technology literally saw the light and what else went on at Fraunhofer IZM last year? All this and much more in the current annual report!