Fraunhofer Institute for Reliability and Microintegration IZM

Fraunhofer Institute for Reliability and Microintegration IZM

Close-up of a multilayer electronic module with a copper-colored, micro‑structured surface mounted on a green circuit board. To the right, a colored pyramid graphic shows the labels “Condition Level 1,” “Level 2,” “Level 3,” and “Level 4” against a blue background.
© Fraunhofer IZM

Condition Level Monitoring

Quality Assurance for Entire Electronics Production Lines


REALIZM Blog | MAKING IDEAS HAPPEN

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© Fraunhofer IZM

INCREACE Projekt
© Fraunhofer IZM

Unlocking the Circular Economy for Plastics

New EU Toolkit for Sustainable Electronics

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© Fraunhofer IZM

A person in protective clothing holds a flat battery cell with two terminal tabs using blue gloves.
© Fraunhofer IZM | Volker Mai

When seconds matter: Protecting AI data centers with nickel-zinc batteries

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© Fraunhofer IZM | Volker Mai

Gruppenfoto
© Silvia Wolf

Eric Fribourg-Blanc visits Fraunhofer IZM-ASSID

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© Silvia Wolf

Microchip being held with tweezers against a blurred blue background.
© Fraunhofer IZM | Volker Mai

EU selects SUPREME consortium to develop the union’s superconducting technology for wider industrialization

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© Fraunhofer IZM | Volker Mai

Person working on a laptop with digital icons of renewable energy, recycling, and CO₂ reduction displayed above the screen.
© Adobe-Stock | mod

Greater transparency for climate protection

Massive interest in a reliable way to assess the product carbon footprint for the IT industry

more info

© Adobe-Stock | mod

Prof. Ulrike Ganesh und Staatssekretär Shri S. Krishnan bei ihrem Austausch im Fraunhofer IZM
© Fraunhofer IZM

German-Indian semiconductor alliance

Visit by Shri S. Krishnan to Fraunhofer IZM

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© Fraunhofer IZM

Visualization of a modern microchip module featuring two interconnected semiconductor components on a dark background.
© IMEC

CHASSIS

European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology

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© IMEC

Business Units Fraunhofer IZM - Medical Engineering

The Science Year 2026 is dedicated to the medicine of the future.

From the e-pill to sensor patches and radar systems for health monitoring to ultrasound-charged implants: the future can already be discovered here.

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Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging from Wafer to System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration
System Integration & Interconnection Technologies
Environmental & Reliability Engineering
RF & Smart Sensor Systems

News

 

© Fraunhofer IZM

News | March 30, 2026

Unlocking the Circular Economy for Plastics

New EU Toolkit for Sustainable Electronics

The European research project INCREACE is setting a new milestone on the path to a truly circular economy: A consortium of universities, research institutions, and industry partners has created a comprehensive playbook and new assessment tool.

more about INCREACE
 

© Fraunhofer IZM | Volker Mai

News | March 24, 2026

When seconds matter

Protecting AI data centers with nickel-zinc batteries

Supported by Fraunhofer IZM, the startup Zn2H2 has created an innovative and cost-effective way to produce nickel-zinc batteries. This type of battery is particularly suitable wherever large amounts of power are needed within a very short time. And they are the perfect choice for one specific market: AI data centers.

more info
 

© Silvia Wolf

News | March 05, 20226

Eric Fribourg-Blanc visits Fraunhofer IZM-ASSID

We are delighted to welcome Eric Fribourg-Blanc, Senior Program Officer at the Chips Joint Undertaking, to Fraunhofer IZM-ASSID on March 3, 2026. The program focused on an exchange of ideas on current projects and future topics of cooperation for establishing the APECS pilot line, as well as a tour of the clean room for cutting-edge 300-mm research.

more info
 

© Fraunhofer IZM | Volker Mai

News | February 06, 2026

EU selects SUPREME consortium to develop the union’s superconducting technology for wider industrialization

The European Union has granted EUR 25 million to the SUPREME consortium, marking a significant milestone in industrialisation of superconducting quantum technologies across Europe.

more info
 

© Adobe-Stock | mod

News | January 20, 2026

Greater transparency for climate protection

Massive interest in a reliable way to assess the product carbon footprint for the IT industry

Net Zero by 2030: That is the ambitious goal of leading IT companies for their products’ carbon emissions, calculated across the entire semiconductor value chain.

more info
 

© Fraunhofer IZM

News | January 16, 2026

German-Indian semiconductor alliance

Shri S. Krishnan, Secretary in the Indian Ministry of Electronics and Information Technology, visited Fraunhofer IZM in Berlin. The focus was on close cooperation with the Research Fab Microelectronics Germany (FMD) and valuable exchanges with host Prof. Ulrike Ganesh, Director of Fraunhofer IZM, and Prof. Ronald Freund, Director of Fraunhofer HHI.

more info
 

© IMEC

News | January 15, 2026

CHASSIS

European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology

more info
 

News

Events

 

Exhibition | April 21 – 24, 2026

Fraunhofer IZM will exhibit e-textiles at Techtextil 2026

Fraunhofer IZM is designing the fabric of the future: wearable, washable, and equipped with sensors. Wearable electronics will be on display at Techtextil, the leading international trade fair for technical textiles, at the Fraunhofer Textile Alliance's joint booth.

more info
 

Conference | May 26 – 29, 2026

ECTC 2026

The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology.

more info
 

Exhibition | June 9 – 11, 2026

PCIM Expo & Conference

Fraunhofer IZM will be presenting technological highlights at PCIM 2026 (Power Conversion Intelligent Motion) in Nuremberg from June 9-11, 2026. The PCIM is the world's leading trade fair on the topics of power electronics, intelligent drive technology, renewable energies as well as energy management.

more info
 

Events

 

© Loewn

Promoting chiplet technologies

Fraunhofer IZM is an integral part of the APECS pilot line with the development of high-precision integration technologies, the prototyping of substrates and research into modular chiplet architectures.

 

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

 

© Leistungszentrum Digitale Vernetzung

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

 

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

 

© Kai Abresch photography

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

 

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

 

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

 

© Fraunhofer IZM | Volker Mai

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

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