Business Units – Information and Communication Technology

The new era of increasing connectivity and digitalization creates new challenges for the design and construction of ICT systems:

The efficient sharing and storing of data needs ever larger data centers and the means to transmit electric and optical signals. Digitalization itself brings its own challenges: There is increasing demand for highly dynamic networks that can transport, process, and analyze data.

Fraunhofer IZM offers comprehensive solutions for these challenges with more than two decades of experience in the field of system integration.

This expertise has been used to develop e.g. a novel processor cooling method that includes micro-channels for integrated coolants in silicon interposers.

Be it the hybrid integration of electro-optical packaging technology with exacting standards for process accuracy or textile manufacturing technologies for Body Area Networks, Fraunhofer IZM is dedicated to enabling SMEs in particular to substantially reduce the cost and time needed for product development. With eco-design, intensive studies into the repairability and recyclability of consumer products like tablets, and research into technical obsolescence, Fraunhofer IZM fully includes the important question of sustainability in electronics development.

With core expertise in the development of application-oriented system designs, Fraunhofer IZM is perfectly placed to develop wireless sensor nodes and systems as well as high-frequency and high-speed communication applications with HQ components for miniaturized, reliable, and extremely energy-efficient wireless communication. Our laboratories are equipped with testing devices operating in frequency ranges from DC to 220 GHz, capable of handling current high-frequency systems e.g. for 5G applications.

Our services:

  • Design of integrated, miniaturized, autonomous, and robust sensor systems and wireless networks
  • Construction of high-frequency systems and electro-optical components
  • Optimization of processes and transfer of construction technologies for highly integrated systems
  • Reliability testing and service life forecasting
  • Consulting and eco-design services for sustainable ICT products


 

News | Project CarriCool

Higher processor performance with microchannel cooler

One of the limiting factors for the computing power of processors is the operating temperature. As part of the CarriCool project under the aegis of IBM, Fraunhofer researchers have developed a new, effective cooling method.

News

Fewer bells and whistles, longer lifetime please

Online study finds that product features are not primary criterion in consumer purchases.

News | Project HyPOT

The world’s first hybrid integrated on-board transceiver using a glass interposer

Within the project HyPOT, Fraunhofer IZM, together with its industrial and academic partners, is developing a hybrid integrated glass-silicon based interposer for data 
communication at a wavelength of 850 nm.