Departments

 

Wafer Level System Integration

Head: Dr. Michael Schiffer, M. Jürgen Wolf

 

System Integration & Interconnection Technologies

Head: Rolf Aschenbrenner, Dr. Andreas Ostmann

 

Environmental & Reliability Engineering

Head: Dr. Nils F. Nissen

 

RF & Smart Sensor Systems

Head: Dr.-Ing. Dr.-Ing. habil. Ivan Ndip,
Harald Pötter