Wafer Level System Integration

With respect to the requirements of future microelectronic systems, 3D integration plays an important role for heterogeneous system integration - meaning the integration of different multi-functional components in one package.

more info

System Integration & Interconnection Technologies

We assist companies with application-oriented pre-competitive research, as well as the development of prototypes and small volume production. Our services include application advice, technology transfer and further qualification of personnel through practical training.

more info

Environmental & Reliability Engineering

The Department Environmental and Reliability Engineering supports technological developments until they reach market maturity with environmental and reliability analysis reaching from nano-characterisation level to evaluation and optimisation at the system level.

more info

RF & Smart Sensor Systems

The Department of RF & Smart Sensor Systems (R3S) researches methods and tools for the targeted, technology-oriented design of electronic systems. By simulating thermal and mechanical coupling and electrical, magnetic, electromagnetic phenomena at stages of the development process, we can compare the functionality and capacity of different technologies as early as during the concept design phase.

more info

Departments

 

Wafer Level System Integration

Head: Oswin Ehrmann, M. Jürgen Wolf

 

System Integration & Interconnection Technologies

Head: Rolf Aschenbrenner, Prof. Martin Schneider-Ramelow
 

Environmental & Reliability Engineering

Head: Dr. Nils F. Nissen, Dr. Olaf Wittler

 

RF & Smart Sensor Systems

Head: Dr. Ivan Ndip, Harald Pötter