With respect to the requirements of future microelectronic systems, 3D integration plays an important role for heterogeneous system integration - meaning the integration of different multi-functional components in one package.
System Integration & Interconnection Technologies#
We assist companies with application-oriented pre-competitive research, as well as the development of prototypes and small volume production. Our services include application advice, technology transfer and further qualification of personnel through practical training.
The Department Environmental and Reliability Engineering supports technological developments until they reach market maturity with environmental and reliability analysis reaching from nano-characterisation level to evaluation and optimisation at the system level.
The Department of RF & Smart Sensor Systems (R3S) researches methods and tools for the targeted, technology-oriented design of electronic systems. By simulating thermal and mechanical coupling and electrical, magnetic, electromagnetic phenomena at stages of the development process, we can compare the functionality and capacity of different technologies as early as during the concept design phase.