Equipment

Integration at Wafer Level

 

ASSID (Dresden): Complete Cu-TSV Process Line

 

Berlin: Wafer Level Packaging Line

 

Berlin: PhoxLab

 

ASSID (Dresden): CMOS & Heterointegration

Fraunhofer IZM-ASSID and Fraunhofer IPMS bundle their competencies in a new R&D center with state-of-the-art equipment.