Search
Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM
IZM-BLOG
Career
Publications
Contact
Deutsch
The Institute
[X]
The Institute
Collaborating with Fraunhofer IZM
Networking with Science and Industry
Infrastructure and Equipment
Awards
Education
Feature Topics
Projects
Career
Departments
[X]
Departments
Wafer Level System Integration
Key Research Areas
Equipment
Services
System Integration & Interconnection Technologies
Key Research Areas
Services
Equipment
Working Groups
Environmental & Reliability Engineering
Key Research Areas
Services
Equipment
Contacts
RF & Smart Sensor Systems
Key Research Areas
Services
Equipment
Working Groups
Business Units
[X]
Business Units
Semiconductors
Automotive
Medical Engineering
Industrial Electronics
Information and Communication Technology
Feature Topics
Services
[X]
Services
Innovation Workshops / Feasibility Studies
Product Development Consultation
Process and Product Development
Testing, Qualification, Reliability
Manufacturing & Prototyping
Lab collaborations
Training
News & Events
[X]
News & Events
Tech News
Trainings and Workshops
Events
Newsletter
REAL IZM | IZM-BLOG
More
Where am I?
Homepage
Departments
Environmental & Reliability Engineering
Services
Services
Services
© MicroPro | Photo by Kevin Mcfeely
Innovation Workshops / Feasibility Studies
Life-cycle Assessment Reviews
Consultancy on current environmental legislation and future trends
Implementation of ErP Requirements in Companies
Reliability Evaluation with FEM
Product Development Consultation
Circular Design Lab
Electromigration in Electrical Contacts
Learning Factory Eco-design
Reliability assessment of electronic systems
Reliability Evaluation with FEM
Process and Product Development
Design assessment and optimisation for reliability
Eco-design of electronic products
Environmental assessment of electronic products
© Fraunhofer IZM
Testing, Qualification, Reliability
Corrosion, Electrochemical Migration and Humidity Diffusion
Mechanical and thermal characterisation of materials
Structure Analysis
Thermal characterisation
Deformation analyses
Vibration measurements and tests
Training
Working group Design conformity for WEEE/RoHS/EuP
Working group System reliability of packaging technologies
Fraunhofer Institute for Reliability and Microintegration IZM